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Manufacturer | Lattice Semiconductor |
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Manufacturer's Part Number | LCMXO2280C-3FTN324C |
Description | FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: LBGA; Package Shape: SQUARE; |
Datasheet | LCMXO2280C-3FTN324C Datasheet |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | 1.71 V |
Package Body Material: | Plastic/Epoxy |
Organization: | 285 CLBS |
Maximum Time At Peak Reflow Temperature (s): | 30 s |
Maximum Seated Height: | 1.7 mm |
No. of Inputs: | 271 |
Sub-Category: | Field Programmable Gate Arrays |
Surface Mount: | Yes |
No. of Outputs: | 271 |
Position Of Terminal: | Bottom |
No. of Terminals: | 324 |
Package Style (Meter): | Grid Array, Low Profile |
JESD-30 Code: | S-PBGA-B324 |
Package Shape: | Square |
Maximum Operating Temperature: | 85 °C (185 °F) |
Package Code: | LBGA |
Width: | 19 mm |
Moisture Sensitivity Level (MSL): | 3 |
Grading Of Temperature: | Other |
Programmable IC Type: | FPGA |
Maximum Supply Voltage: | 3.465 V |
Nominal Supply Voltage (V): | 1.8 |
No. of Logic Cells: | 2280 |
No. of CLBs: | 285 |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | 0 °C (32 °F) |
Qualification: | No |
Package Equivalence Code: | BGA324,18X18,40 |
Finishing Of Terminal Used: | Tin Silver Copper |
Length: | 19 mm |
Form Of Terminal: | Ball |
Pitch Of Terminal: | 1 mm |
Peak Reflow Temperature (C): | 260 °C (500 °F) |
Power Supplies (V): | 1.8/3.3 V |