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| Manufacturer | Maxim Integrated |
|---|---|
| Manufacturer's Part Number | DS2175+ |
| Description | ELASTIC BUFFER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; |
| Datasheet | DS2175+ Datasheet |
| In Stock | 2,132 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 5 V |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Maximum Seated Height: | 4.572 mm |
| Sub-Category: | Other Telecom ICs |
| Surface Mount: | NO |
| Maximum Supply Current: | .016 mA |
| Terminal Finish: | MATTE TIN |
| No. of Terminals: | 16 |
| Terminal Position: | DUAL |
| Package Style (Meter): | IN-LINE |
| Technology: | CMOS |
| JESD-30 Code: | R-PDIP-T16 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | THROUGH-HOLE |
| Maximum Operating Temperature: | 70 Cel |
| Package Code: | DIP |
| Width: | 7.62 mm |
| Moisture Sensitivity Level (MSL): | 1 |
| Telecom IC Type: | ELASTIC BUFFER |
| JESD-609 Code: | e3 |
| Minimum Operating Temperature: | 0 Cel |
| No. of Functions: | 1 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | DIP16,.3 |
| Length: | 19.175 mm |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | 2.54 mm |
| Temperature Grade: | COMMERCIAL |
| Power Supplies (V): | 5 |
