Maxim Integrated - DS2436Z/TR+W

  1. Home
  2. Maxim Integrated - DS2436Z/TR+W
DS2436Z/TR+W by Maxim Integrated

Image shown is a representation only.

Manufacturer Maxim Integrated
Manufacturer's Part Number DS2436Z/TR+W
Description Other Memory ICs; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30;
Datasheet DS2436Z/TR+W Datasheet
In Stock1,669
NAME DESCRIPTION
Maximum Time At Peak Reflow Temperature (s): 30
Peak Reflow Temperature (C): 260
Plant 5!
Your quote plants 5 trees.

Pricing (USD)

Qty. Unit Price Ext. Price
1,669 - -

Popular Products

Category Top Products

SM27C512-20J by Texas Instruments

SM27C512-20J

Texas Instruments

Other Memory ICs;
M36W0R6030T0ZAQE by STMicroelectronics

M36W0R6030T0ZAQE

STMicroelectronics

M36W0R6030T0ZAQE by STMicroelectronics is a versatile memory IC featuring 4M x 16 organization, operating at a nominal voltage of 1.8V. It combines FLASH and SRAM technologies for efficient data storage in industrial applications. With a max temp of 85 °C and access time of 70ns, it ensures reliable performance.
DLPR100DWC by Texas Instruments

DLPR100DWC

Texas Instruments

DLPR100DWC by Texas Instruments is a memory circuit IC with 2MX8 organization, 8-bit memory width, and 16777216 bit memory density. It operates at temperatures ranging from -40 to 85 °C and has a max standby current of 0.00005 Amp. Ideal for industrial applications requiring small outline package style and surface mount compatibility.
MR44V064BMAZAATL by Lapis Semiconductor

MR44V064BMAZAATL

Lapis Semiconductor

MR44V064BMAZAATL by Lapis Semiconductor is a synchronous memory IC with 8Kx8 organization and 65536-bit memory density. Operating at 3.3V, it has a temperature range of -40 to 85°C, making it suitable for industrial applications requiring small outline, low profile packages in a rectangular shape.
C1702A by Advanced Micro Devices

C1702A

Advanced Micro Devices

Other Memory ICs; Temperature Grade: COMMERCIAL; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Memory Width: 8;
M36W216T85ZA1T by STMicroelectronics

M36W216T85ZA1T

STMicroelectronics

M36W216T85ZA1T from STMicroelectronics is a low-profile, asynchronous memory IC with a 3V nominal voltage. It features a 16-bit width and operates within -40 °C to 70 °C. Ideal for compact applications, it offers high density with 16M bits in a 66-terminal grid array package.
MR0A16ACYS35R by Everspin Technologies

MR0A16ACYS35R

Everspin Technologies

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Maximum Seated Height: 1.2 mm;
EPCQ4ASI8N by Intel

EPCQ4ASI8N

Intel

EPCQ4ASI8N by Intel is a 512Kx8 NOR type memory IC with 3-STATE output. Operating at 100 MHz, it has a supply voltage range of 2.7V to 3.6V and industrial temperature grade. With a compact package style and serial interface, it's ideal for applications requiring high-speed data storage in harsh environments.
TMS27PC32-2JE by Texas Instruments

TMS27PC32-2JE

Texas Instruments

Other Memory ICs;
TMS27PC32-120JE by Texas Instruments

TMS27PC32-120JE

Texas Instruments

Other Memory ICs;
DS2401 by Maxim Integrated

DS2401

Maxim Integrated

DS2401 by Maxim Integrated is a 64-bit memory circuit with CMOS technology. It operates asynchronously at 5V, with a supply voltage range of 2.8-6V. This through-hole IC in cylindrical package shape is ideal for industrial applications requiring reliable memory storage and identification capabilities.
DS6417P-002 by Analog Devices

DS6417P-002

Analog Devices

DS6417P-002 by Analog Devices is a 256Kx8 MEMORY CIRCUIT IC with CMOS tech. Operating at 0-70 °C, it has a supply voltage range of 4.5-5.5V. Suitable for applications requiring MICROELECTRONIC ASSEMBLY package style and synchronous operation mode.
DS1993L-F5-C01 by Analog Devices

DS1993L-F5-C01

Analog Devices

MEMORY CIRCUIT;
DS1204U-G5C by Analog Devices

DS1204U-G5C

Analog Devices

DS1204U-G5C by Analog Devices is a 256-bit MEMORY CIRCUIT with 256x1 organization. It operates in SYNCHRONOUS mode at 5V, suitable for COMMERCIAL applications. With a temperature range of 0-70 °C, it comes in a RECTANGULAR package style with TIN LEAD terminal finish.
S71PL127NB0HHW4U0 by Spansion

S71PL127NB0HHW4U0

Spansion

Spansion S71PL127NB0HHW4U0 is an 8MX16 FLASH+PSRAM memory IC with 134217728-bit density and 70ns access time. It operates at 3V, in a thin profile grid array package, suitable for applications requiring high-speed data storage and retrieval.
MR25H256CDF by Everspin Technologies

MR25H256CDF

Everspin Technologies

MR25H256CDF by Everspin Technologies is a 32KX8 memory IC with CMOS technology. Operating at 3V, it has a temperature range of -40 to 85 °C and offers 262144 bits memory density. Ideal for industrial applications, this synchronous memory chip comes in a small outline package with surface mount capability.
47L04-E/ST by Microchip Technology

47L04-E/ST

Microchip Technology

47L04-E/ST by Microchip Technology is a small outline, thin profile memory IC with 512x8 organization. It operates synchronously and combines EEPROM with SRAM technology. Ideal for automotive applications, it has a temperature range of -40 to 125°C and requires a supply voltage b/w 2.7V to 3.6V.
TMS2150-35DW by Texas Instruments

TMS2150-35DW

Texas Instruments

TMS2150-35DW by Texas Instruments is a 512x9 MEMORY CIRCUIT IC with 35ns access time, suitable for commercial applications. It operates at 5V, has a max standby current of 0.145A, and comes in a small outline package with dual terminals.
C1702A by Intel

C1702A

Intel

The Intel C1702A is a 256x8 MOS memory IC with 3-STATE output. It features a max access time of 1000ns and operates b/w 0°C to 70°C. Commonly used in commercial applications, this IC has a package style of IN-LINE and offers a memory density of 2048 bits.
M36W216T100ZA1T by STMicroelectronics

M36W216T100ZA1T

STMicroelectronics

M36W216T100ZA1T by STMicroelectronics is a low-profile, asynchronous memory IC with a 3V nominal voltage and operates b/w 2.7V to 3.3V. It features a density of 16Mbit and supports up to 1M x 16 organization. Ideal for commercial applications requiring compact memory solutions.