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Manufacturer | Microchip Technology |
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Manufacturer's Part Number | AT91SAM9G45C-CU |
Description | MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 324; Package Code: TFBGA; Package Shape: SQUARE; |
Datasheet | AT91SAM9G45C-CU Datasheet |
In Stock | 267 |
NAME | DESCRIPTION |
---|---|
Minimum Supply Voltage: | .9 V |
Package Body Material: | PLASTIC/EPOXY |
Integrated Cache: | YES |
Maximum Time At Peak Reflow Temperature (s): | 40 |
Sub-Category: | Microcontrollers |
Surface Mount: | YES |
On Chip Data RAM Width: | 8 |
No. of DMA Channels: | 37 |
Address Bus Width: | 26 |
Technology: | CMOS |
RAM Words: | 65536 |
Maximum Clock Frequency: | 50 MHz |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Package Code: | TFBGA |
Moisture Sensitivity Level (MSL): | 3 |
No. of External Interrupts: | 1 |
Bit Size: | 32 |
DAC Channels: | NO |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA324,18X18,32 |
PWM Channels: | YES |
Peak Reflow Temperature (C): | 260 |
ROM Programmability: | FLASH |
Terminal Pitch: | .8 mm |
CPU Family: | ARM9 |
Nominal Supply Voltage: | 1 V |
Maximum Seated Height: | 1.4 mm |
Terminal Finish: | TIN SILVER COPPER |
ADC Channels: | YES |
No. of Terminals: | 324 |
No. of Serial I/Os: | 7 |
DMA Channels: | YES |
Terminal Position: | BOTTOM |
Format: | FIXED POINT |
Package Style (Meter): | GRID ARRAY, THIN PROFILE, FINE PITCH |
No. of I/O Lines: | 160 |
JESD-30 Code: | S-PBGA-B324 |
ROM Words: | 65536 |
Maximum Operating Temperature: | 85 Cel |
Width: | 15 mm |
Speed: | 400 rpm |
Peripheral IC Type: | MICROPROCESSOR, RISC |
Maximum Supply Voltage: | 1.1 V |
RAM Bytes: | 65536 |
Low Power Mode: | YES |
Boundary Scan: | YES |
External Data Bus Width: | 32 |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | -40 Cel |
Length: | 15 mm |
Temperature Grade: | INDUSTRIAL |
Power Supplies (V): | 1,1.8/3.3,3.3 |