Microchip Technology - AX250-FGG256M

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AX250-FGG256M by Microchip Technology

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Manufacturer Microchip Technology
Manufacturer's Part Number AX250-FGG256M
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: MILITARY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;
Datasheet AX250-FGG256M Datasheet
In Stock547
NAME DESCRIPTION
Minimum Supply Voltage: 1.425 V
Package Body Material: Plastic/Epoxy
Organization: 2816 CLBS, 250000 Gates
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Combinatorial Delay of a CLB: 0.99 ns
Maximum Seated Height: 1.7 mm
No. of Inputs: 248
Sub-Category: Field Programmable Gate Arrays
Surface Mount: Yes
No. of Outputs: 248
Position Of Terminal: Bottom
No. of Terminals: 256
No. of Equivalent Gates: 250000
Package Style (Meter): Grid Array, Low Profile
Screening Level: MIL-STD-883 Class B
JESD-30 Code: S-PBGA-B256
Maximum Clock Frequency: 649 MHz
Package Shape: Square
Maximum Operating Temperature: 125 °C (257 °F)
Package Code: LBGA
Width: 17 mm
Moisture Sensitivity Level (MSL): 3
Grading Of Temperature: Military
Programmable IC Type: FPGA
Maximum Supply Voltage: 1.575 V
Nominal Supply Voltage (V): 1.5
Packing Method: Tray
Technology Used: CMOS
No. of Logic Cells: 4224
No. of CLBs: 2816
JESD-609 Code: e1
Minimum Operating Temperature: -55 °C (-67 °F)
Qualification: No
Package Equivalence Code: BGA256,16X16,40
Finishing Of Terminal Used: Tin Silver Copper
Length: 17 mm
Form Of Terminal: Ball
Additional Features: 250000 system gates avaiable
Pitch Of Terminal: 1 mm
Peak Reflow Temperature (C): 250 °C (482 °F)
Power Supplies (V): 1.5,1.5/3.3,2.5/3.3 V
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