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| Manufacturer | Microchip Technology |
|---|---|
| Manufacturer's Part Number | AX250-FGG256M |
| Description | FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: MILITARY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE; |
| Datasheet | AX250-FGG256M Datasheet |
| In Stock | 547 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 1.425 V |
| Package Body Material: | Plastic/Epoxy |
| Organization: | 2816 CLBS, 250000 Gates |
| Maximum Time At Peak Reflow Temperature (s): | 30 s |
| Maximum Combinatorial Delay of a CLB: | 0.99 ns |
| Maximum Seated Height: | 1.7 mm |
| No. of Inputs: | 248 |
| Sub-Category: | Field Programmable Gate Arrays |
| Surface Mount: | Yes |
| No. of Outputs: | 248 |
| Position Of Terminal: | Bottom |
| No. of Terminals: | 256 |
| No. of Equivalent Gates: | 250000 |
| Package Style (Meter): | Grid Array, Low Profile |
| Screening Level: | MIL-STD-883 Class B |
| JESD-30 Code: | S-PBGA-B256 |
| Maximum Clock Frequency: | 649 MHz |
| Package Shape: | Square |
| Maximum Operating Temperature: | 125 °C (257 °F) |
| Package Code: | LBGA |
| Width: | 17 mm |
| Moisture Sensitivity Level (MSL): | 3 |
| Grading Of Temperature: | Military |
| Programmable IC Type: | FPGA |
| Maximum Supply Voltage: | 1.575 V |
| Nominal Supply Voltage (V): | 1.5 |
| Packing Method: | Tray |
| Technology Used: | CMOS |
| No. of Logic Cells: | 4224 |
| No. of CLBs: | 2816 |
| JESD-609 Code: | e1 |
| Minimum Operating Temperature: | -55 °C (-67 °F) |
| Qualification: | No |
| Package Equivalence Code: | BGA256,16X16,40 |
| Finishing Of Terminal Used: | Tin Silver Copper |
| Length: | 17 mm |
| Form Of Terminal: | Ball |
| Additional Features: | 250000 system gates avaiable |
| Pitch Of Terminal: | 1 mm |
| Peak Reflow Temperature (C): | 250 °C (482 °F) |
| Power Supplies (V): | 1.5,1.5/3.3,2.5/3.3 V |









