Microchip Technology - M2S005-VF256

M2S005-VF256 by Microchip Technology

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Manufacturer Microchip Technology
Manufacturer's Part Number M2S005-VF256
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LFBGA; Package Shape: SQUARE;
Datasheet M2S005-VF256 Datasheet
In Stock1,257
NAME DESCRIPTION
Minimum Supply Voltage: 1.14 V
Package Body Material: Plastic/Epoxy
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Seated Height: 1.56 mm
No. of Inputs: 161
Sub-Category: Field Programmable Gate Arrays
Surface Mount: Yes
No. of Outputs: 161
Position Of Terminal: Bottom
No. of Terminals: 256
Package Style (Meter): Grid Array, Low Profile, Fine Pitch
JESD-30 Code: S-PBGA-B256
Package Shape: Square
Maximum Operating Temperature: 85 °C (185 °F)
Package Code: LFBGA
Width: 14 mm
Grading Of Temperature: Other
Programmable IC Type: FPGA
Maximum Supply Voltage: 1.26 V
Nominal Supply Voltage (V): 1.2
Packing Method: Tray
Technology Used: CMOS
No. of Logic Cells: 6060
JESD-609 Code: e0
Minimum Operating Temperature: 0 °C (32 °F)
Qualification: No
Package Equivalence Code: BGA256,16X16,32
Finishing Of Terminal Used: Tin/Lead
Length: 14 mm
Form Of Terminal: Ball
Additional Features: LG-MIN, WD-MIN
Pitch Of Terminal: .8 mm
Peak Reflow Temperature (C): 240 °C (464 °F)
Power Supplies (V): 1.2 V
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