Microchip Technology - M7AFS600-FGG256

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M7AFS600-FGG256 by Microchip Technology

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Manufacturer Microchip Technology
Manufacturer's Part Number M7AFS600-FGG256
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;
Datasheet M7AFS600-FGG256 Datasheet
In Stock1,202
NAME DESCRIPTION
Minimum Supply Voltage: 1.425 V
Package Body Material: Plastic/Epoxy
Organization: 600000 Gates
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Seated Height: 1.7 mm
Surface Mount: Yes
Position Of Terminal: Bottom
No. of Terminals: 256
No. of Equivalent Gates: 600000
Package Style (Meter): Grid Array, Low Profile
JESD-30 Code: S-PBGA-B256
Package Shape: Square
Maximum Operating Temperature: 70 °C (158 °F)
Package Code: LBGA
Width: 17 mm
Moisture Sensitivity Level (MSL): 3
Grading Of Temperature: Commercial
Programmable IC Type: FPGA
Maximum Supply Voltage: 1.575 V
Nominal Supply Voltage (V): 1.5
Packing Method: Tray
Technology Used: CMOS
JESD-609 Code: e1
Minimum Operating Temperature: 0 °C (32 °F)
Qualification: No
Finishing Of Terminal Used: Tin Silver Copper
Length: 17 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
Peak Reflow Temperature (C): 250 °C (482 °F)
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