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| Manufacturer | Microchip Technology |
|---|---|
| Manufacturer's Part Number | PIC32MX170F256B-I/SP |
| Description | MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; |
| Datasheet | PIC32MX170F256B-I/SP Datasheet |
| In Stock | 323 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 2.3 V |
| Package Body Material: | PLASTIC/EPOXY |
| Integrated Cache: | NO |
| Surface Mount: | NO |
| On Chip Data RAM Width: | 8 |
| No. of DMA Channels: | 4 |
| Address Bus Width: | 0 |
| Screening Level: | TS 16949 |
| Technology: | CMOS |
| RAM Words: | 65536 |
| Maximum Clock Frequency: | 50 MHz |
| Package Shape: | RECTANGULAR |
| Terminal Form: | THROUGH-HOLE |
| Package Code: | DIP |
| No. of External Interrupts: | 5 |
| Bit Size: | 32 |
| DAC Channels: | NO |
| PWM Channels: | YES |
| Additional Features: | THIS DEVICE FEATURES 3KBYTE OF BOOT FLASH MEMORY |
| Connectivity: | I2C(2), I2S(2), IRDA, LIN, SPI(2), UART(2) |
| ROM Programmability: | FLASH |
| Analog To Digital Convertors: | 10-Ch 10-Bit |
| Terminal Pitch: | 2.54 mm |
| CPU Family: | PIC32 |
| Nominal Supply Voltage: | 3.3 V |
| Maximum Seated Height: | 5.08 mm |
| Maximum Supply Current: | 37 mA |
| Terminal Finish: | MATTE TIN |
| ADC Channels: | YES |
| No. of Terminals: | 28 |
| No. of Timers: | 5 |
| DMA Channels: | YES |
| Terminal Position: | DUAL |
| Format: | FIXED POINT |
| Package Style (Meter): | IN-LINE |
| No. of I/O Lines: | 21 |
| JESD-30 Code: | R-PDIP-T28 |
| ROM Words: | 262144 |
| Maximum Operating Temperature: | 85 Cel |
| Width: | 7.62 mm |
| Data EEPROM Size: | 0 |
| Speed: | 40 rpm |
| Peripheral IC Type: | MICROCONTROLLER, RISC |
| Maximum Supply Voltage: | 3.6 V |
| RAM Bytes: | 65536 |
| Low Power Mode: | YES |
| Boundary Scan: | YES |
| External Data Bus Width: | 0 |
| Peripherals: | BOR, COMPARATOR(3), DMA(4), POR, PWM, RTC, TIMER(5), WDT |
| JESD-609 Code: | e3 |
| Minimum Operating Temperature: | -40 Cel |
| Length: | 34.671 mm |
| On Chip Program ROM Width: | 8 |
| Temperature Grade: | INDUSTRIAL |
