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| Manufacturer | Microchip Technology |
|---|---|
| Manufacturer's Part Number | ZL30136GGG2 |
| Description | ELASTIC BUFFER; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 64; Package Code: BGA; Package Shape: SQUARE; |
| Datasheet | ZL30136GGG2 Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 1.8 V |
| Maximum Seated Height: | 1.72 mm |
| Sub-Category: | Other Telecom ICs |
| Surface Mount: | YES |
| Maximum Supply Current: | 153 mA |
| Terminal Finish: | TIN SILVER COPPER |
| No. of Terminals: | 64 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY |
| JESD-30 Code: | S-PBGA-B64 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | BGA |
| Width: | 9 mm |
| Telecom IC Type: | ELASTIC BUFFER |
| JESD-609 Code: | e1 |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA64,8X8,40 |
| Length: | 9 mm |
| Additional Features: | ALSO REQUIRED 3.3V SUPPLY |
| Terminal Pitch: | 1 mm |
| Temperature Grade: | INDUSTRIAL |
| Power Supplies (V): | 1.8,3.3 |
