Micron Technology - EDB1316BDBH-1DAUT-F-R

  1. Home
  2. Micron Technology - EDB1316BDBH-1DAUT-F-R
EDB1316BDBH-1DAUT-F-R by Micron Technology

Image shown is a representation only.

Manufacturer Micron Technology
Manufacturer's Part Number EDB1316BDBH-1DAUT-F-R
Description LPDDR2 DRAM; Temperature Grade: AUTOMOTIVE; No. of Terminals: 134; Package Code: VFBGA; Package Shape: RECTANGULAR; Additional Features: SELF REFRESH; IT ALSO REQUIRES 1.8V NOM;
Datasheet EDB1316BDBH-1DAUT-F-R Datasheet
In Stock2,334
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 64MX16
Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED
Maximum Seated Height: 1 mm
Access Mode: SINGLE BANK PAGE BURST
Minimum Supply Voltage (Vsup): 1.14 V
Surface Mount: YES
No. of Terminals: 134
No. of Words: 67108864 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Technology: CMOS
JESD-30 Code: R-PBGA-B134
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 125 Cel
Package Code: VFBGA
Width: 10 mm
No. of Ports: 1
Memory Density: 1073741824 bit
Self Refresh: YES
Memory IC Type: LPDDR2 DRAM
Minimum Operating Temperature: -40 Cel
Memory Width: 16
No. of Functions: 1
Length: 11.5 mm
No. of Words Code: 64M
Nominal Supply Voltage / Vsup (V): 1.2
Additional Features: SELF REFRESH; IT ALSO REQUIRES 1.8V NOM
Peak Reflow Temperature (C): NOT SPECIFIED
Terminal Pitch: .65 mm
Temperature Grade: AUTOMOTIVE
Maximum Supply Voltage (Vsup): 1.3 V
Plant 5!
Your quote plants 5 trees.

Pricing (USD)

Qty. Unit Price Ext. Price
2,334 - -

Popular Products

Category Top Products

AS4C8M16SA-6TINTR by Alliance Memory

AS4C8M16SA-6TINTR

Alliance Memory

Alliance Memory's AS4C8M16SA-6TINTR is a 8MX16 Synchronous DRAM with 166 MHz clock frequency, operating at -40 to 85 °C. Ideal for industrial applications, it features common I/O type, self-refresh mode, and small outline package style.
IS43QR16256B-083RBLI-TR by Integrated Silicon Solution

IS43QR16256B-083RBLI-TR

Integrated Silicon Solution

IS43QR16256B-083RBLI-TR by Integrated Silicon Solution is a DDR4 DRAM with 256MX16 organization, operating at up to 1200.48 MHz clock frequency. It features synchronous operation, self-refresh capability, and common input/output type. Ideal for industrial applications requiring high memory density and fast data processing.
AS4C512M16D3LA-10BIN by Alliance Memory

AS4C512M16D3LA-10BIN

Alliance Memory

Alliance Memory's AS4C512M16D3LA-10BIN is a 512MX16 DDR DRAM MODULE with 1.35V supply, operating from -40 to 95 °C. It features synchronous operation, self-refresh capability, and multi-bank page burst access mode. Ideal for industrial applications requiring high memory density in a compact grid array package.
IS42S32400F-6TL by Integrated Silicon Solution

IS42S32400F-6TL

Integrated Silicon Solution

IS42S32400F-6TL by Integrated Silicon Solution is a 4MX32 SDRAM with 3.3V supply, operating at 166MHz clock frequency. It features synchronous operation, self-refresh capability, and common I/O type. Ideal for applications requiring high-speed memory access in commercial temperature environments.
MT41K128M8DA-107IT:J by Micron Technology

MT41K128M8DA-107IT:J

Micron Technology

MT41K128M8DA-107IT:J by Micron Technology is a DDR3L DRAM with 128MX8 organization and 1.35V nominal voltage. It operates at a max clock frequency of 933 MHz and is commonly used in applications requiring high-speed memory access, such as servers and high-performance computing systems.
K4T51163QE-ZCE6 by Samsung

K4T51163QE-ZCE6

Samsung

Samsung's K4T51163QE-ZCE6 DDR2 DRAM features 32MX16 organization, 333 MHz clock frequency, and 536870912 bit memory density. Ideal for applications requiring high-speed data processing with a max operating temperature of 95°C.
MT46H256M32L4LE-48WT:C by Micron Technology

MT46H256M32L4LE-48WT:C

Micron Technology

Micron Technology's MT46H256M32L4LE-48WT:C is a 256MX32 LPDDR1 DRAM with 32-bit memory width. It operates synchronously at 1.8V, featuring self-refresh and four-bank page burst access mode. Suitable for applications requiring high memory density, fast access time of 5ns, and operating temperatures b/w -25 to 85°C.
W632GU6NB12I by Winbond Electronics

W632GU6NB12I

Winbond Electronics

The Winbond Electronics W632GU6NB12I is a DDR3L DRAM with 128MX16 organization, operating at 1.35V. It features a grid array package style with very thin profile and fine pitch, suitable for industrial applications requiring high memory density and multi-bank page burst access mode.
MT48LC16M16A2B4-6A:G by Micron Technology

MT48LC16M16A2B4-6A:G

Micron Technology

MT48LC16M16A2B4-6A:G by Micron Technology is a 16MX16 DRAM with 3.3V supply, operating at 167MHz clock frequency. It features synchronous operation, self-refresh capability, and common I/O type. Ideal for commercial applications requiring fast access times and high memory density in a compact grid array package.
MT48LC4M32B2P-6IT:G by Micron Technology

MT48LC4M32B2P-6IT:G

Micron Technology

Micron Technology's MT48LC4M32B2P-6IT:G is a 3.3V Synchronous DRAM with 4MX32 organization, operating at -40 to 85 °C. It features self-refresh mode, 86 terminals in a small outline package, and offers fast access time of 5.5 ns. Ideal for industrial applications requiring high memory density and synchronous operation.
AS4C512M16D4-75BCN by Alliance Memory

AS4C512M16D4-75BCN

Alliance Memory

Alliance Memory's AS4C512M16D4-75BCN is a 512MX16 DDR4 DRAM with 1333 MHz clock frequency, 1.2V supply voltage, and 95°C operating temperature. Ideal for applications requiring high-speed synchronous memory with common I/O type and self-refresh capability.
MT48LC4M32B2F5-7IT:GTR by Micron Technology

MT48LC4M32B2F5-7IT:GTR

Micron Technology

Micron Technology's MT48LC4M32B2F5-7IT:GTR is a 3.3V, 4MX32 Synchronous DRAM with 85°C max temp. Ideal for industrial applications, it features self-refresh mode, very thin profile package style, and operates in synchronous mode with a memory width of 32 bits.
HYB25D512160BE-6 by Qimonda Ag

HYB25D512160BE-6

Qimonda Ag

DDR1 DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 66; Package Code: TSOP2; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
MTA18ASF2G72PZ-3G2J3 by Micron Technology

MTA18ASF2G72PZ-3G2J3

Micron Technology

Micron Technology's MTA18ASF2G72PZ-3G2J3 is a DDR4 DRAM MODULE with 2GX72 organization, operating at up to 1600 MHz clock frequency. It features a memory density of 154618822656 bits and is suitable for applications requiring high-speed synchronous memory access in servers or data centers.
M393B5673GB0-CH9 by Samsung

M393B5673GB0-CH9

Samsung

Samsung M393B5673GB0-CH9 DDR DRAM MODULE features 256MX72 organization, operates at 667 MHz clock frequency, and has a memory density of 19327352832 bit. Ideal for high-performance computing applications requiring fast data processing and storage capabilities.
IS43DR16160A-3DBLI-TR by Integrated Silicon Solution

IS43DR16160A-3DBLI-TR

Integrated Silicon Solution

IS43DR16160A-3DBLI-TR by Integrated Silicon Solution is a 16MX16 DDR2 DRAM with 333 MHz clock frequency. Operating at 1.8V, it offers 16M words and supports synchronous mode with self-refresh capability. Ideal for industrial applications requiring high memory density and fast access times.
IS43R16320D-6BL by Integrated Silicon Solution

IS43R16320D-6BL

Integrated Silicon Solution

IS43R16320D-6BL by Integrated Silicon Solution is a 32MX16 DDR1 DRAM with a max clock frequency of 166 MHz. It operates synchronously and has a memory density of 536870912 bit. It is commonly used in applications requiring high-speed data storage and retrieval.
MT48LC4M32B2P-6AAAT:L by Micron Technology

MT48LC4M32B2P-6AAAT:L

Micron Technology

Micron Technology's MT48LC4M32B2P-6AAAT:L is a 4MX32 Synchronous DRAM with 32-bit memory width. Operating at 3.3V, it offers a max access time of 5.4ns and self-refresh capability. Ideal for industrial applications requiring high-speed data processing in a compact form factor.
K4S511632D-UC75 by Samsung

K4S511632D-UC75

Samsung

Samsung's K4S511632D-UC75 is a 32MX16 DRAM with 3.3V supply, operating at 133MHz. Ideal for commercial applications, it features synchronous operation, self-refresh capability, and a small outline package style.
K4H561638N-LCCC by Samsung

K4H561638N-LCCC

Samsung

Samsung's K4H561638N-LCCC DDR1 DRAM features 16MX16 organization, 200 MHz clock frequency, and 70°C max operating temp. Ideal for applications requiring high memory density and fast access times in commercial-grade devices.