Micron Technology - EDBA232B1MA-1D-F

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EDBA232B1MA-1D-F by Micron Technology

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Manufacturer Micron Technology
Manufacturer's Part Number EDBA232B1MA-1D-F
Description DDR2 DRAM; No. of Terminals: 134; Package Code: TFBGA; Package Shape: RECTANGULAR; Technology: CMOS; Surface Mount: YES;
Datasheet EDBA232B1MA-1D-F Datasheet
In Stock2,207
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 512MX32
Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED
Maximum Seated Height: 1.2 mm
Access Mode: DUAL BANK PAGE BURST
Minimum Supply Voltage (Vsup): 1.7 V
Surface Mount: YES
No. of Terminals: 134
No. of Words: 536870912 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH
Technology: CMOS
JESD-30 Code: R-PBGA-B134
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: SYNCHRONOUS
Package Code: TFBGA
Width: 11.5 mm
No. of Ports: 1
Memory Density: 17179869184 bit
Self Refresh: YES
Memory IC Type: DDR2 DRAM
Memory Width: 32
No. of Functions: 1
Length: 13 mm
No. of Words Code: 512M
Nominal Supply Voltage / Vsup (V): 1.8
Additional Features: AUTO/SELF REFRESH; IT ALSO REQUIRES 1.2V NOM
Peak Reflow Temperature (C): NOT SPECIFIED
Terminal Pitch: .65 mm
Maximum Supply Voltage (Vsup): 1.95 V
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