Micron Technology - EDJ1116EJBG-JS-F

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EDJ1116EJBG-JS-F by Micron Technology

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Manufacturer Micron Technology
Manufacturer's Part Number EDJ1116EJBG-JS-F
Description DRAM MODULE; Temperature Grade: OTHER; No. of Terminals: 96; Package Code: TFBGA; Package Shape: RECTANGULAR; Maximum Seated Height: 1.2 mm;
Datasheet EDJ1116EJBG-JS-F Datasheet
In Stock421
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 64MX16
Maximum Seated Height: 1.2 mm
Access Mode: MULTI BANK PAGE BURST
Minimum Supply Voltage (Vsup): 1.283 V
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
No. of Terminals: 96
No. of Words: 67108864 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH
Technology: CMOS
JESD-30 Code: R-PBGA-B96
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 85 Cel
Package Code: TFBGA
Width: 7.5 mm
No. of Ports: 1
Memory Density: 1073741824 bit
Self Refresh: YES
Memory IC Type: DRAM MODULE
JESD-609 Code: e1
Minimum Operating Temperature: 0 Cel
Memory Width: 16
No. of Functions: 1
Length: 13.5 mm
No. of Words Code: 64M
Nominal Supply Voltage / Vsup (V): 1.35
Additional Features: AUTO/SELF REFRESH
Terminal Pitch: .8 mm
Temperature Grade: OTHER
Maximum Supply Voltage (Vsup): 1.45 V
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