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Manufacturer | White Electronic Designs |
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Manufacturer's Part Number | W3H64M72E-533SBI |
Description | DDR2 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 208; Package Code: BGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR; |
Datasheet | W3H64M72E-533SBI Datasheet |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Organization: | 64MX72 |
Output Characteristics: | 3-STATE |
Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
Maximum Seated Height: | 3.64 mm |
Access Mode: | MULTI BANK PAGE BURST |
Minimum Supply Voltage (Vsup): | 1.7 V |
Sub-Category: | DRAMs |
Surface Mount: | YES |
Maximum Supply Current: | 1750 mA |
No. of Terminals: | 208 |
Maximum Clock Frequency (fCLK): | 267 MHz |
No. of Words: | 67108864 words |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY |
Technology: | CMOS |
JESD-30 Code: | R-PBGA-B208 |
Package Shape: | RECTANGULAR |
Terminal Form: | BALL |
Operating Mode: | SYNCHRONOUS |
Maximum Operating Temperature: | 85 Cel |
Package Code: | BGA |
Width: | 16 mm |
Input/Output Type: | COMMON |
No. of Ports: | 1 |
Memory Density: | 4831838208 bit |
Self Refresh: | YES |
Memory IC Type: | DDR2 DRAM |
JESD-609 Code: | e0 |
Minimum Operating Temperature: | -40 Cel |
Memory Width: | 72 |
No. of Functions: | 1 |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA208,11X19,40 |
Refresh Cycles: | 8192 |
Length: | 22 mm |
Maximum Access Time: | .5 ns |
No. of Words Code: | 64M |
Nominal Supply Voltage / Vsup (V): | 1.8 |
Additional Features: | AUTO/SELF REFRESH |
Peak Reflow Temperature (C): | NOT SPECIFIED |
Terminal Pitch: | 1 mm |
Temperature Grade: | INDUSTRIAL |
Maximum Supply Voltage (Vsup): | 1.9 V |
Power Supplies (V): | 1.8 |