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| Manufacturer | Micron Technology |
|---|---|
| Manufacturer's Part Number | EDX1032BBBG-3C-F |
| Description | RAMBUS DRAM; No. of Terminals: 150; Package Code: TBGA; Package Shape: SQUARE; Technology: CMOS; No. of Words Code: 32M; |
| Datasheet | EDX1032BBBG-3C-F Datasheet |
| In Stock | 1,114 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Organization: | 32MX32 |
| Maximum Seated Height: | 1.15 mm |
| Access Mode: | MULTI BANK PAGE BURST |
| Minimum Supply Voltage (Vsup): | 1.425 V |
| Surface Mount: | YES |
| Terminal Finish: | TIN SILVER COPPER |
| No. of Terminals: | 150 |
| No. of Words: | 33554432 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, THIN PROFILE |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B150 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Operating Mode: | SYNCHRONOUS |
| Package Code: | TBGA |
| Width: | 15.5 mm |
| No. of Ports: | 1 |
| Memory Density: | 1073741824 bit |
| Self Refresh: | YES |
| Memory IC Type: | RAMBUS DRAM |
| JESD-609 Code: | e1 |
| Memory Width: | 32 |
| No. of Functions: | 1 |
| Length: | 15.5 mm |
| No. of Words Code: | 32M |
| Nominal Supply Voltage / Vsup (V): | 1.5 |
| Additional Features: | AUTO/SELF REFRESH |
| Terminal Pitch: | 1 mm |
| Maximum Supply Voltage (Vsup): | 1.575 V |









