EDX1032BBBG-3C-F by Micron Technology | Memory ICs

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Manufacturer	Micron Technology
Manufacturer's Part Number	EDX1032BBBG-3C-F
Description	RAMBUS DRAM; No. of Terminals: 150; Package Code: TBGA; Package Shape: SQUARE; Technology: CMOS; No. of Words Code: 32M;
Datasheet	EDX1032BBBG-3C-F Datasheet
In Stock	1,114

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Organization:	32MX32
Maximum Seated Height:	1.15 mm
Access Mode:	MULTI BANK PAGE BURST
Minimum Supply Voltage (Vsup):	1.425 V
Surface Mount:	YES
Terminal Finish:	TIN SILVER COPPER
No. of Terminals:	150
No. of Words:	33554432 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, THIN PROFILE
Technology:	CMOS
JESD-30 Code:	S-PBGA-B150
Package Shape:	SQUARE
Terminal Form:	BALL
Operating Mode:	SYNCHRONOUS
Package Code:	TBGA
Width:	15.5 mm
No. of Ports:	1
Memory Density:	1073741824 bit
Self Refresh:	YES
Memory IC Type:	RAMBUS DRAM
JESD-609 Code:	e1
Memory Width:	32
No. of Functions:	1
Length:	15.5 mm
No. of Words Code:	32M
Nominal Supply Voltage / Vsup (V):	1.5
Additional Features:	AUTO/SELF REFRESH
Terminal Pitch:	1 mm
Maximum Supply Voltage (Vsup):	1.575 V

Pricing (USD)

Qty.	Unit Price	Ext. Price
1,114	-	-

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RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;

Other Regulators; No. of Terminals: 3; Operating Temperature (TJ-Min): 0 Cel; Terminal Pitch: 2.54 mm; Maximum Load Regulation (%): 1.5 %; Nominal Dropout Voltage-1: 3 V;