K4B4G0846B-HCK0 by Samsung | Memory ICs

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Manufacturer	Samsung
Manufacturer's Part Number	K4B4G0846B-HCK0
Description	DDR3 DRAM; No. of Terminals: 78; Package Code: TFBGA; Package Shape: RECTANGULAR; Organization: 512MX8; Length: 11 mm;
Datasheet	K4B4G0846B-HCK0 Datasheet

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Organization:	512MX8
Maximum Seated Height:	1.2 mm
Access Mode:	MULTI BANK PAGE BURST
Minimum Supply Voltage (Vsup):	1.425 V
Surface Mount:	YES
No. of Terminals:	78
No. of Words:	536870912 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, THIN PROFILE, FINE PITCH
Technology:	CMOS
JESD-30 Code:	R-PBGA-B78
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Operating Mode:	SYNCHRONOUS
Package Code:	TFBGA
Width:	10 mm
No. of Ports:	1
Memory Density:	4294967296 bit
Self Refresh:	YES
Memory IC Type:	DDR3 DRAM
Memory Width:	8
No. of Functions:	1
Length:	11 mm
No. of Words Code:	512M
Nominal Supply Voltage / Vsup (V):	1.5
Additional Features:	AUTO/SELF REFRESH
Terminal Pitch:	.8 mm
Maximum Supply Voltage (Vsup):	1.575 V

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