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| Manufacturer | Micron Technology |
|---|---|
| Manufacturer's Part Number | MT29F32G08AECCBH1-10IT:C |
| Description | FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 100; Package Code: BGA; Package Shape: RECTANGULAR; Terminal Form: BALL; |
| Datasheet | MT29F32G08AECCBH1-10IT:C Datasheet |
| In Stock | 1,492 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Organization: | 4GX8 |
| Sub-Category: | Flash Memories |
| Surface Mount: | YES |
| Maximum Supply Current: | 50 mA |
| Command User Interface: | YES |
| No. of Terminals: | 100 |
| No. of Words: | 4294967296 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY |
| Technology: | CMOS |
| JESD-30 Code: | R-PBGA-B100 |
| No. of Sectors/Size: | 8K |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | BGA |
| Memory Density: | 34359738368 bit |
| Sector Size (Words): | 512K |
| Toggle Bit: | NO |
| Memory IC Type: | FLASH |
| Minimum Operating Temperature: | -40 Cel |
| Memory Width: | 8 |
| Page Size (words): | 4K |
| Type: | SLC NAND TYPE |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA100,10X17,40 |
| Maximum Access Time: | 20 ns |
| No. of Words Code: | 4G |
| Ready or Busy: | YES |
| Parallel or Serial: | PARALLEL |
| Terminal Pitch: | 1 mm |
| Temperature Grade: | INDUSTRIAL |
| Data Polling: | NO |
| Power Supplies (V): | 3/3.3 |
