Micron Technology - MT29F8G08ADBFAH4-AAT:F

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MT29F8G08ADBFAH4-AAT:F by Micron Technology

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Manufacturer Micron Technology
Manufacturer's Part Number MT29F8G08ADBFAH4-AAT:F
Description FLASH; Temperature Grade: INDUSTRIAL; Package Code: BGA; Package Shape: UNSPECIFIED; Terminal Form: BALL; Programming Voltage (V): 1.8;
In Stock596
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 1GX8
Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED
Programming Voltage (V): 1.8
Surface Mount: YES
No. of Words: 1073741824 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Technology: CMOS
JESD-30 Code: X-PBGA-B
Package Shape: UNSPECIFIED
Terminal Form: BALL
Operating Mode: ASYNCHRONOUS
Maximum Operating Temperature: 105 Cel
Package Code: BGA
Memory Density: 8589934592 bit
Memory IC Type: FLASH
Minimum Operating Temperature: -40 Cel
Memory Width: 8
No. of Functions: 1
Type: SLC NAND TYPE
No. of Words Code: 1G
Nominal Supply Voltage / Vsup (V): 1.8
Peak Reflow Temperature (C): NOT SPECIFIED
Temperature Grade: INDUSTRIAL
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