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| Manufacturer | Micron Technology |
|---|---|
| Manufacturer's Part Number | MT29F8G08ADBFAH4-AAT:F |
| Description | FLASH; Temperature Grade: INDUSTRIAL; Package Code: BGA; Package Shape: UNSPECIFIED; Terminal Form: BALL; Programming Voltage (V): 1.8; |
| In Stock | 596 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Organization: | 1GX8 |
| Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
| Programming Voltage (V): | 1.8 |
| Surface Mount: | YES |
| No. of Words: | 1073741824 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY |
| Technology: | CMOS |
| JESD-30 Code: | X-PBGA-B |
| Package Shape: | UNSPECIFIED |
| Terminal Form: | BALL |
| Operating Mode: | ASYNCHRONOUS |
| Maximum Operating Temperature: | 105 Cel |
| Package Code: | BGA |
| Memory Density: | 8589934592 bit |
| Memory IC Type: | FLASH |
| Minimum Operating Temperature: | -40 Cel |
| Memory Width: | 8 |
| No. of Functions: | 1 |
| Type: | SLC NAND TYPE |
| No. of Words Code: | 1G |
| Nominal Supply Voltage / Vsup (V): | 1.8 |
| Peak Reflow Temperature (C): | NOT SPECIFIED |
| Temperature Grade: | INDUSTRIAL |









