Micron Technology - MT38W1011AA033JZZI.XB8

MT38W1011AA033JZZI.XB8 by Micron Technology

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Manufacturer Micron Technology
Manufacturer's Part Number MT38W1011AA033JZZI.XB8
Description MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 52; Package Code: TFBGA; Package Shape: RECTANGULAR; Memory Width: 16;
Datasheet MT38W1011AA033JZZI.XB8 Datasheet
In Stock103
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 2MX16
Maximum Seated Height: 1.2 mm
Minimum Supply Voltage (Vsup): 1.7 V
Surface Mount: YES
No. of Terminals: 52
No. of Words: 2097152 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH
Technology: CMOS
JESD-30 Code: R-PBGA-B52
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 85 Cel
Package Code: TFBGA
Width: 4 mm
Memory Density: 33554432 bit
Memory IC Type: MEMORY CIRCUIT
Minimum Operating Temperature: -40 Cel
Memory Width: 16
No. of Functions: 1
Length: 6 mm
No. of Words Code: 2M
Nominal Supply Voltage / Vsup (V): 1.8
Additional Features: IT ALSO CONTAINS 16MBIT(1MBIT X 16) PSRAM
Terminal Pitch: .5 mm
Temperature Grade: INDUSTRIAL
Maximum Supply Voltage (Vsup): 1.95 V
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