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Manufacturer | Micron Technology |
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Manufacturer's Part Number | MT42L256M64D4EV-25WT:A |
Description | LPDDR2 DRAM; Temperature Grade: OTHER; No. of Terminals: 253; Package Code: TFBGA; Refresh Cycles: 8192; Package Shape: SQUARE; |
Datasheet | MT42L256M64D4EV-25WT:A Datasheet |
In Stock | 872 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Maximum Standby Current: | .002 Amp |
Organization: | 256MX64 |
Output Characteristics: | 3-STATE |
Maximum Seated Height: | 1.2 mm |
Access Mode: | MULTI BANK PAGE BURST |
Minimum Supply Voltage (Vsup): | 1.7 V |
Sub-Category: | DRAMs |
Surface Mount: | YES |
Maximum Supply Current: | 194 mA |
No. of Terminals: | 253 |
Maximum Clock Frequency (fCLK): | 400 MHz |
No. of Words: | 268435456 words |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, THIN PROFILE, FINE PITCH |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B253 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Operating Mode: | SYNCHRONOUS |
Maximum Operating Temperature: | 85 Cel |
Package Code: | TFBGA |
Width: | 11 mm |
Input/Output Type: | COMMON |
No. of Ports: | 1 |
Memory Density: | 17179869184 bit |
Self Refresh: | YES |
Sequential Burst Length: | 4,8,16 |
Memory IC Type: | LPDDR2 DRAM |
Minimum Operating Temperature: | -30 Cel |
Memory Width: | 64 |
No. of Functions: | 1 |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA253,17X17,20 |
Refresh Cycles: | 8192 |
Interleaved Burst Length: | 4,8,16 |
Length: | 11 mm |
Maximum Access Time: | 5.5 ns |
No. of Words Code: | 256M |
Nominal Supply Voltage / Vsup (V): | 1.8 |
Additional Features: | SELF REFRESH; IT ALSO REQUIRES 1.2V NOM |
Terminal Pitch: | .5 mm |
Temperature Grade: | OTHER |
Maximum Supply Voltage (Vsup): | 1.95 V |
Power Supplies (V): | 1.2,1.8 |