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| Manufacturer | Micron Technology |
|---|---|
| Manufacturer's Part Number | MT44K64M18RB-093F |
| Description | RLDRAM3; No. of Terminals: 168; Package Code: TBGA; Package Shape: SQUARE; Operating Mode: SYNCHRONOUS; Surface Mount: YES; |
| Datasheet | MT44K64M18RB-093F Datasheet |
| In Stock | 2,174 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Standby Current: | .225 Amp |
| Organization: | 64MX18 |
| Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
| Maximum Seated Height: | 1.2 mm |
| Access Mode: | MULTI BANK PAGE BURST |
| Minimum Supply Voltage (Vsup): | 1.28 V |
| Surface Mount: | YES |
| Maximum Supply Current: | 1160 mA |
| No. of Terminals: | 168 |
| Maximum Clock Frequency (fCLK): | 1075.2 MHz |
| No. of Words: | 67108864 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, THIN PROFILE |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B168 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Operating Mode: | SYNCHRONOUS |
| Maximum Operating Temperature: | 95 Cel |
| Package Code: | TBGA |
| Width: | 13.5 mm |
| No. of Ports: | 1 |
| Memory Density: | 1207959552 bit |
| Self Refresh: | NO |
| Sequential Burst Length: | 2,4,8 |
| Memory IC Type: | RLDRAM3 |
| Minimum Operating Temperature: | 0 Cel |
| Memory Width: | 18 |
| No. of Functions: | 1 |
| Package Equivalence Code: | BGA168,13X13,40 |
| Interleaved Burst Length: | 2,4,8 |
| Length: | 13.5 mm |
| No. of Words Code: | 64M |
| Nominal Supply Voltage / Vsup (V): | 1.35 |
| Additional Features: | AUTO REFRESH |
| Peak Reflow Temperature (C): | NOT SPECIFIED |
| Terminal Pitch: | 1 mm |
| Maximum Supply Voltage (Vsup): | 1.42 V |
