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Manufacturer | Micron Technology |
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Manufacturer's Part Number | MT52L256M64D2LZ-107WT:B |
Description | LPDDR3 DRAM; Temperature Grade: OTHER; No. of Terminals: 216; Package Code: VFBGA; Package Shape: SQUARE; Self Refresh: YES; |
Datasheet | MT52L256M64D2LZ-107WT:B Datasheet |
In Stock | 122 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Maximum Standby Current: | .012 Amp |
Organization: | 256MX64 |
Output Characteristics: | 3-STATE |
Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
Maximum Seated Height: | .8 mm |
Access Mode: | SINGLE BANK PAGE BURST |
Minimum Supply Voltage (Vsup): | 1.14 V |
Surface Mount: | YES |
Maximum Supply Current: | 320 mA |
No. of Terminals: | 216 |
Maximum Clock Frequency (fCLK): | 933 MHz |
No. of Words: | 268435456 words |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B216 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Operating Mode: | SYNCHRONOUS |
Maximum Operating Temperature: | 85 Cel |
Package Code: | VFBGA |
Width: | 12 mm |
Input/Output Type: | COMMON |
No. of Ports: | 1 |
Memory Density: | 17179869184 bit |
Self Refresh: | YES |
Memory IC Type: | LPDDR3 DRAM |
Minimum Operating Temperature: | -30 Cel |
Memory Width: | 64 |
No. of Functions: | 1 |
Package Equivalence Code: | BGA216,29X29,16 |
Length: | 12 mm |
No. of Words Code: | 256M |
Nominal Supply Voltage / Vsup (V): | 1.2 |
Additional Features: | AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOM |
Peak Reflow Temperature (C): | NOT SPECIFIED |
Terminal Pitch: | .4 mm |
Temperature Grade: | OTHER |
Maximum Supply Voltage (Vsup): | 1.3 V |