MT55L1MY36PF-5 by Micron Technology | Memory ICs

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Manufacturer	Micron Technology
Manufacturer's Part Number	MT55L1MY36PF-5
Description	ZBT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 165; Package Code: TBGA; Package Shape: RECTANGULAR; Terminal Position: BOTTOM;
Datasheet	MT55L1MY36PF-5 Datasheet
In Stock	2,221

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Organization:	1MX36
Maximum Seated Height:	1.2 mm
Minimum Supply Voltage (Vsup):	3.135 V
Surface Mount:	YES
Terminal Finish:	TIN SILVER COPPER
No. of Terminals:	165
No. of Words:	1048576 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, THIN PROFILE
Technology:	CMOS
JESD-30 Code:	R-PBGA-B165
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Operating Mode:	SYNCHRONOUS
Maximum Operating Temperature:	70 Cel
Package Code:	TBGA
Width:	15 mm
Memory Density:	37748736 bit
Memory IC Type:	ZBT SRAM
JESD-609 Code:	e1
Minimum Operating Temperature:	0 Cel
Memory Width:	36
No. of Functions:	1
Qualification:	Not Qualified
Length:	17 mm
Maximum Access Time:	3.2 ns
No. of Words Code:	1M
Nominal Supply Voltage / Vsup (V):	3.3
Additional Features:	PIPELINED ARCHITECTURE
Parallel or Serial:	PARALLEL
Terminal Pitch:	1 mm
Temperature Grade:	COMMERCIAL
Maximum Supply Voltage (Vsup):	3.465 V

Pricing (USD)

Qty.	Unit Price	Ext. Price
2,221	-	-

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