MT58L256L36DF-6 by Micron Technology | Memory ICs

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Manufacturer	Micron Technology
Manufacturer's Part Number	MT58L256L36DF-6
Description	CACHE SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 165; Package Code: TBGA; Package Shape: RECTANGULAR; Memory Width: 36;
Datasheet	MT58L256L36DF-6 Datasheet
In Stock	1,461

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Standby Current:	.01 Amp
Organization:	256KX36
Output Characteristics:	3-STATE
Maximum Seated Height:	1.2 mm
Minimum Supply Voltage (Vsup):	3.135 V
Sub-Category:	SRAMs
Surface Mount:	YES
Maximum Supply Current:	475 mA
Terminal Finish:	Tin/Lead (Sn/Pb)
No. of Terminals:	165
No. of Words:	262144 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, THIN PROFILE
Technology:	CMOS
JESD-30 Code:	R-PBGA-B165
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Operating Mode:	SYNCHRONOUS
Maximum Operating Temperature:	70 Cel
Package Code:	TBGA
Width:	13 mm
Input/Output Type:	COMMON
Memory Density:	9437184 bit
Minimum Standby Voltage:	3.14 V
Memory IC Type:	CACHE SRAM
JESD-609 Code:	e0
Minimum Operating Temperature:	0 Cel
Memory Width:	36
No. of Functions:	1
Qualification:	Not Qualified
Package Equivalence Code:	BGA165,11X15,40
Length:	15 mm
Maximum Access Time:	3.5 ns
No. of Words Code:	256K
Nominal Supply Voltage / Vsup (V):	3.3
Additional Features:	PIPELINED ARCHITECTURE
Parallel or Serial:	PARALLEL
Terminal Pitch:	1 mm
Temperature Grade:	COMMERCIAL
Maximum Supply Voltage (Vsup):	3.6 V
Power Supplies (V):	3.3

Pricing (USD)

Qty.	Unit Price	Ext. Price
1,461	-	-

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