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Manufacturer | Micron Technology |
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Manufacturer's Part Number | MTFC16GAPALBH-AATTR |
Description | FLASH CARD; No. of Terminals: 153; Package Code: TFBGA; Package Shape: RECTANGULAR; Maximum Seated Height: 1.2 mm; Memory Width: 8; |
Datasheet | MTFC16GAPALBH-AATTR Datasheet |
In Stock | 230 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Organization: | 16GX8 |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Maximum Seated Height: | 1.2 mm |
Minimum Supply Voltage (Vsup): | 2.7 V |
Surface Mount: | YES |
Terminal Finish: | TIN SILVER COPPER |
No. of Terminals: | 153 |
Maximum Clock Frequency (fCLK): | 200 MHz |
No. of Words: | 17179869184 words |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, THIN PROFILE, FINE PITCH |
Technology: | CMOS |
JESD-30 Code: | R-PBGA-B153 |
Package Shape: | RECTANGULAR |
Terminal Form: | BALL |
Operating Mode: | SYNCHRONOUS |
Maximum Operating Temperature: | 105 Cel |
Package Code: | TFBGA |
Width: | 11.5 mm |
Memory Density: | 137438953472 bit |
Memory IC Type: | FLASH CARD |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | -40 Cel |
Memory Width: | 8 |
No. of Functions: | 1 |
Type: | NAND TYPE |
Package Equivalence Code: | BGA153,14X14,20 |
Length: | 13 mm |
No. of Words Code: | 16G |
Peak Reflow Temperature (C): | 260 |
Parallel or Serial: | PARALLEL |
Terminal Pitch: | .5 mm |
Maximum Supply Voltage (Vsup): | 3.6 V |