Micron Technology - MTFC32GJVED-4MIT

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MTFC32GJVED-4MIT by Micron Technology

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Manufacturer Micron Technology
Manufacturer's Part Number MTFC32GJVED-4MIT
Description MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 169; Package Code: VFBGA; Package Shape: RECTANGULAR;
Datasheet MTFC32GJVED-4MIT Datasheet
In Stock428
NAME DESCRIPTION
Minimum Supply Voltage: 1.65 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1.8 V
Maximum Seated Height: 1 mm
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
No. of Terminals: 169
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Technology: CMOS
JESD-30 Code: R-PBGA-B169
Package Shape: RECTANGULAR
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: VFBGA
Width: 14 mm
Other Names: -MTFC32GJVED-4MIT
MTFC32GJVED-4MIT
-MTFC32GJVED-4M IT-ND
MTFC32GJVED-4M IT-ND
163477
-MTFC32GJVED-4M IT
Peripheral IC Type: MICROPROCESSOR CIRCUIT
Maximum Supply Voltage: 1.95 V
JESD-609 Code: e1
Minimum Operating Temperature: -40 Cel
Length: 18 mm
Additional Features: IT ALSO OPERATES AT 3.3 VOLTS
Terminal Pitch: .5 mm
Temperature Grade: INDUSTRIAL
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