Micron Technology - MTFC8GLWDM-3LAATZ

MTFC8GLWDM-3LAATZ by Micron Technology

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Manufacturer Micron Technology
Manufacturer's Part Number MTFC8GLWDM-3LAATZ
Description FLASH CARD; Temperature Grade: INDUSTRIAL; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 3.6 V;
Datasheet MTFC8GLWDM-3LAATZ Datasheet
In Stock2,228
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 8GX8
Output Characteristics: OPEN-DRAIN
Maximum Seated Height: 1.2 mm
Minimum Supply Voltage (Vsup): 2.7 V
Surface Mount: YES
No. of Terminals: 153
No. of Words: 8589934592 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH
Technology: CMOS
JESD-30 Code: R-PBGA-B153
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 105 Cel
Package Code: BGA
Width: 11.5 mm
Memory Density: 68719476736 bit
Memory IC Type: FLASH CARD
Minimum Operating Temperature: -40 Cel
Memory Width: 8
No. of Functions: 1
Package Equivalence Code: BGA153,14X14,20
Length: 13 mm
No. of Words Code: 8G
Ready or Busy: YES
Parallel or Serial: PARALLEL
Terminal Pitch: .5 mm
Temperature Grade: INDUSTRIAL
Maximum Supply Voltage (Vsup): 3.6 V
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Pricing (USD)

Qty. Unit Price Ext. Price
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