Micron Technology - MTFDHBM1T0TDP-1AT12AIYY

MTFDHBM1T0TDP-1AT12AIYY by Micron Technology

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Manufacturer	Micron Technology
Manufacturer's Part Number	MTFDHBM1T0TDP-1AT12AIYY
Description	FLASH MODULE; Temperature Grade: INDUSTRIAL; Package Shape: RECTANGULAR; Maximum Operating Temperature: 95 Cel; Memory Width: 8; Terminal Position: BOTTOM;
Datasheet	MTFDHBM1T0TDP-1AT12AIYY Datasheet
In Stock	61

MTFDHBM1T0TDP-1AT12AIYY Technical Details

NAME	DESCRIPTION
Package Body Material:	UNSPECIFIED
Memory Density:	8796093022208 bit
Organization:	1TX8
Surface Mount:	YES
Memory IC Type:	FLASH MODULE
Minimum Operating Temperature:	-40 Cel
Memory Width:	8
No. of Functions:	1
Type:	TLC NAND TYPE
No. of Words:	1099511627776 words
Terminal Position:	BOTTOM
Technology:	CMOS
No. of Words Code:	1T
JESD-30 Code:	R-XBGA-B
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Operating Mode:	ASYNCHRONOUS
Maximum Operating Temperature:	95 Cel
Temperature Grade:	INDUSTRIAL

Pricing (USD)

Qty.	Unit Price	Ext. Price
61	-	-

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