Micron Technology - NAND01GW3A2CZD6F

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NAND01GW3A2CZD6F by Micron Technology

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Manufacturer Micron Technology
Manufacturer's Part Number NAND01GW3A2CZD6F
Description FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 55; Package Code: FBGA; Package Shape: RECTANGULAR; No. of Sectors/Size: 8K;
Datasheet NAND01GW3A2CZD6F Datasheet
In Stock1,639
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Standby Current: .00005 Amp
Organization: 128MX8
Sub-Category: Flash Memories
Surface Mount: YES
Maximum Supply Current: 30 mA
Command User Interface: YES
No. of Terminals: 55
No. of Words: 134217728 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, FINE PITCH
Technology: CMOS
JESD-30 Code: R-PBGA-B55
No. of Sectors/Size: 8K
Package Shape: RECTANGULAR
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: FBGA
Memory Density: 1073741824 bit
Sector Size (Words): 16K
Toggle Bit: NO
Memory IC Type: FLASH
Minimum Operating Temperature: -40 Cel
Memory Width: 8
Page Size (words): 512
Type: SLC NAND TYPE
Qualification: Not Qualified
Package Equivalence Code: BGA55,8X12,32
Maximum Access Time: 18 ns
No. of Words Code: 128M
Ready or Busy: YES
Parallel or Serial: PARALLEL
Terminal Pitch: .8 mm
Temperature Grade: INDUSTRIAL
Data Polling: NO
Power Supplies (V): 3/3.3
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Pricing (USD)

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