Mill-max Mfg - 111-93-308-41-001000

  1. Home
  2. Mill-max Mfg - 111-93-308-41-001000
111-93-308-41-001000 by Mill-max Mfg

Image shown is a representation only.

Manufacturer Mill-max Mfg
Manufacturer's Part Number 111-93-308-41-001000
Description IC SOCKET; Device Type Used On: DIP8; Housing Material: POLYETHYLENE; JESD-609 Code: e0; Contact Config: RECTANGLE; Contact Finish (Termination): Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier;
Datasheet 111-93-308-41-001000 Datasheet
NAME DESCRIPTION
Other Names: 1119330841001000
ED60008
IC Socket Type: IC Socket
Contact Config: Rectangle
Contact Finish (Termination): Tin / Lead with Nickel Barrier
Housing Material: Polyethylene (PE)
Device Type Used On: DIP8
Contact Material: Beryllium Copper
Additional Features: 94V-0
JESD-609 Code: e0
No. of Contacts: 8
Plant 5!
Your quote plants 5 trees.

Popular Products

Category Top Products

PL08-Q by Omron

PL08-Q

Omron

RELAY SOCKET; Contact Finish (Mating): NOT APPLICABLE; Contact Material: NOT APPLICABLE;
2-821949-5 by TE Connectivity

2-821949-5

TE Connectivity

IC SOCKET; Device Type Used On: PQFP132; Housing Material: LIQUID CRYSTAL POLYMER; Contact Material: PHOSPHOR BRONZE; Additional Features: POLARIZED; Contact Finish (Mating): NOT SPECIFIED;
8080-1G14 by TE Connectivity

8080-1G14

TE Connectivity

TE Connectivity's 8080-1G14 is a PHENOLIC chip carrier socket for TO-3 devices. With 3 contacts, it has a current rating of 10A and can withstand up to 2121VAC. Ideal for applications requiring a straight mounting style and round pin sockets in temperatures ranging from -55°C to 125°C.
XR2T-2221-N by Omron

XR2T-2221-N

Omron

IC SOCKET; Manufacturer Series: XR2T; Contact Finish (Termination): GOLD FLASH; JESD-609 Code: e4; Contact Finish (Mating): GOLD FLASH; Contact Material: BERYLLIUM COPPER;
IC160Z-0204-240 by Yamaichi Electronics

IC160Z-0204-240

Yamaichi Electronics

Yamaichi Electronics' IC160Z-0204-240 is a POLYAMIDE chip carrier socket for PLCC20 devices with 20 contacts. Featuring COPPER ALLOY contacts, it has an insulation resistance of 500MΩ and dielectric voltage of 350VAC. Ideal for surface mount applications, this socket has a current rating of 1A and bellowed contact style.
MT78745- by TE Connectivity

MT78745-

TE Connectivity

IC SOCKET; Housing Material: POLYAMIDE; Contact Finish (Mating): NOT SPECIFIED; Termination Type: SCREW; No. of Contacts: 8; Contact Material: NOT SPECIFIED;
HLT-1905-G-H by Samtec

HLT-1905-G-H

Samtec

The Samtec HLT-1905-G-H is a plastic chip carrier IC socket with 95 brass contacts. It is designed for use on PGA95 devices, featuring gold over nickel contact finish for mating and termination. Ideal for applications requiring reliable connections in electronic components.
XR3G-6411 by Omron

XR3G-6411

Omron

IC SOCKET; Contact Material: BERYLLIUM COPPER; Contact Finish (Termination): GOLD; Contact Finish (Mating): GOLD (10); JESD-609 Code: e4;
DSP2A-PSL2 by Panasonic

DSP2A-PSL2

Panasonic

Panasonic's DSP2A-PSL2 is a chip carrier IC socket with 8 contacts, 7.62mm PCB spacing, and 4242VAC dielectric voltage. Ideal for relay devices, it has a -40 to 65°C operating range and solder termination for reliable performance in various applications.
224-1275-00-0602J by 3m Electronic Products Division

224-1275-00-0602J

3m Electronic Products Division

The 3M Electronic Products Division's 224-1275-00-0602J is a DIP24 IC socket with 24 contacts. It features Beryllium Copper contact material and Gold (Au) finish for mating and termination. The housing material is Glass Filled Polysulfone, making it ideal for chip carrier applications.
2227MC-08-03-18-F1 by Multicomp Pro

2227MC-08-03-18-F1

Multicomp Pro

IC SOCKET; Device Type Used On: DIP8; Housing Material: POLYBUTYLENE TEREPHTHALATE; No. of Contacts: 8; JESD-609 Code: e4; Additional Features: STANDARD: UL94-0;
XR2T-4801-N by Omron

XR2T-4801-N

Omron

IC SOCKET; Contact Material: BERYLLIUM COPPER; Contact Finish (Termination): GOLD; JESD-609 Code: e4; Manufacturer Series: XR2T; Contact Finish (Mating): GOLD (30);
XR2A-2215 by Omron

XR2A-2215

Omron

IC SOCKET; Manufacturer Series: XR2;
XR2A-2471-N by Omron

XR2A-2471-N

Omron

IC SOCKET; Contact Finish (Mating): GOLD (30); Contact Finish (Termination): GOLD; Manufacturer Series: XR2A; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4;
153-10-952-00-001000 by Mill-max Mfg

153-10-952-00-001000

Mill-max Mfg

153-10-952-00-001000 by Mill-max Mfg is a PLASTIC IC SOCKET for DIP52 devices with 52 contacts. It features GOLD OVER NICKEL contact finish and RECTANGLE contact configuration. Ideal for Chip Carrier IC & Component Sockets applications.
HLT-0716-G-H by Samtec

HLT-0716-G-H

Samtec

Samtec's HLT-0716-G-H is a 112-contact IC socket with brass contacts and gold finish. It is designed for use on PGA112 devices, featuring a plastic housing material. Ideal for chip carrier applications requiring reliable connections in electronic systems.
D01-9923246 by Harwin Plc

D01-9923246

Harwin Plc

IC SOCKET; Device Type Used On: SIP32; Housing Material: POLYAMIDE46; No. of Contacts: 32; Contact Finish (Mating): NOT APPLICABLE; Contact Finish (Termination): Tin (Sn) - with Nickel (Ni) barrier;
XR2D-1401-N by Omron

XR2D-1401-N

Omron

IC SOCKET; Contact Finish (Mating): GOLD (30); Contact Finish (Termination): Gold (Au); JESD-609 Code: e4; Contact Material: BERYLLIUM COPPER;
PTF14A by Omron

PTF14A

Omron

RELAY SOCKET; Device Type Used On: RELAY; Contact Finish (Mating): NOT SPECIFIED; Contact Finish (Termination): NOT APPLICABLE; No. of Contacts: 14; Contact Material: NOT SPECIFIED;
2-1571550-9 by TE Connectivity

2-1571550-9

TE Connectivity

TE Connectivity's 2-1571550-9 is a DIP28 IC socket with 28 contacts, rated at 3A current. It features a PCB contact row spacing of 15.24mm and uses solder termination. With a housing made of polyethylene, it operates b/w -55°C to 105°C, suitable for various electronic applications requiring reliable connections.