Mill-max Mfg - 123-13-322-41-001000

  1. Home
  2. Mill-max Mfg - 123-13-322-41-001000
123-13-322-41-001000 by Mill-max Mfg

Image shown is a representation only.

Manufacturer Mill-max Mfg
Manufacturer's Part Number 123-13-322-41-001000
Description IC SOCKET; Device Type Used On: DIP22; Housing Material: PLASTIC; Contact Config: RECTANGLE; Contact Material: NOT SPECIFIED; JESD-609 Code: e4;
Datasheet 123-13-322-41-001000 Datasheet
NAME DESCRIPTION
Other Names: 12313-32241001000
1231332241001000
IC Socket Type: IC Socket
Contact Config: Rectangle
Contact Finish (Termination): Gold over Nickel
Housing Material: Plastic
Device Type Used On: DIP22
JESD-609 Code: e4
No. of Contacts: 22
Plant 5!
Your quote plants 5 trees.

Popular Products

Category Top Products

XR2A-4811-N by Omron

XR2A-4811-N

Omron

IC SOCKET; Contact Finish (Termination): GOLD; JESD-609 Code: e4; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED;
M12883/45-01 by Stpi Group

M12883/45-01

Stpi Group

RELAY SOCKET; Device Type Used On: RELAY; Housing Material: POLYETHERIMIDE; Additional Features: LOW PROFILE; JESD-609 Code: e4; No. of Contacts: 8;
28-3508-311 by Aries Electronics

28-3508-311

Aries Electronics

Aries Electronics 28-3508-311 is a DIP28 IC socket with 28 contacts, featuring rectangular PCB contact pattern spaced at 7.62mm. It uses wire wrap termination and has a body size of 1.4" x 0.7" x 0.19". Ideal for applications requiring reliable connections in electronic circuits.
1-1437535-2 by TE Connectivity

1-1437535-2

TE Connectivity

TE Connectivity 1-1437535-2 is a DIP8 IC SOCKET with 8 contacts, rated at 3A current. It has a PCB contact row spacing of 7.62mm and uses gold termination for soldering. Ideal for applications requiring a chip carrier socket with insulation resistance of 5G ohm and operating temperatures from -55 to 125°C.
214-44-314-01-670799 by Mill-max Mfg

214-44-314-01-670799

Mill-max Mfg

214-44-314-01-670799 by Mill-max Mfg is a NYLON46 chip carrier IC socket with 14 contacts, TIN finish. It is designed for DIP14 devices, featuring a rectangular contact configuration. Ideal for electronic applications requiring reliable and durable connections in integrated circuits.
XR2A-2002 by Omron

XR2A-2002

Omron

IC SOCKET; Manufacturer Series: XR2A; JESD-609 Code: e4; Contact Finish (Mating): GOLD (30); Contact Finish (Termination): GOLD; Contact Material: BERYLLIUM COPPER;
110-44-328-41-001000 by Mill-max Mfg

110-44-328-41-001000

Mill-max Mfg

Mill-max Mfg's 110-44-328-41-001000 is a POLYETHYLENE IC SOCKET for DIP28 devices with 28 contacts. Features MATTE TIN OVER NICKEL finish, RECTANGLE contact config. Ideal for Chip Carrier IC & Component Sockets applications.
P2R-057P by Omron

P2R-057P

Omron

RELAY SOCKET; Contact Finish (Mating): NOT SPECIFIED; Contact Finish (Termination): NOT APPLICABLE; Contact Material: NOT SPECIFIED;
DSP2A-PSL2 by Panasonic

DSP2A-PSL2

Panasonic

Panasonic's DSP2A-PSL2 is a chip carrier IC socket with 8 contacts, 7.62mm PCB spacing, and 4242VAC dielectric voltage. Ideal for relay devices, it has a -40 to 65°C operating range and solder termination for reliable performance in various applications.
XR2D-1601-N by Omron

XR2D-1601-N

Omron

IC SOCKET; JESD-609 Code: e4; Contact Finish (Mating): GOLD (30); Contact Finish (Termination): Gold (Au); Contact Material: BERYLLIUM COPPER;
HLT-1712-T-R by Samtec

HLT-1712-T-R

Samtec

HLT-1712-T-R by Samtec is a plastic chip carrier IC socket with 204 brass contacts. It is used on PGA204 devices and has a contact finish of tin over nickel (50). This IC socket is ideal for applications requiring reliable and secure connections.
XR2A-1815 by Omron

XR2A-1815

Omron

IC SOCKET; Manufacturer Series: XR2;
173-10-324-00-001000 by Mill-max Mfg

173-10-324-00-001000

Mill-max Mfg

173-10-324-00-001000 by Mill-max Mfg is a PLASTIC Chip Carrier IC Socket for DIP24 devices. Featuring 24 contacts with GOLD OVER NICKEL finish, it is a RECTANGLE contact configuration ideal for integrated circuit applications.
DSP2A-PS by Panasonic

DSP2A-PS

Panasonic

RELAY SOCKET; Device Type Used On: RELAY; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED; No. of Contacts: 6;
110-91-322-41-001000 by Mill-max Mfg

110-91-322-41-001000

Mill-max Mfg

110-91-322-41-001000 by Mill-max Mfg is a Chip Carrier IC Socket with POLYETHYLENE housing and BERYLLIUM COPPER contacts. Featuring 22 gold-plated contacts, it is designed for DIP22 devices. The socket has Tin/Lead termination with Nickel barrier, making it ideal for various electronic applications.
27E122 by TE Connectivity

27E122

TE Connectivity

TE Connectivity's 27E122 is a Chip Carrier IC Socket with GLASS FILLED POLYESTER housing. It features 8 RND PIN-SKT contacts and SCREW termination, suitable for RELAY devices. With dimensions of 2.385" x 1.296" x 0.925", it is ideal for IC SOCKET applications.
PTF14A-E by Omron

PTF14A-E

Omron

RELAY SOCKET; Device Type Used On: RELAY; Contact Finish (Mating): NOT APPLICABLE; Contact Material: NOT APPLICABLE; No. of Contacts: 14;
540-44-032-17-400000 by Mill-max Mfg

540-44-032-17-400000

Mill-max Mfg

The Mill-max Mfg 540-44-032-17-400000 is a PLCC32 IC socket with 32 contacts, rated for 1A current. It features a polyphenylene sulfide housing material, surface mount termination, and bellowed contact style. With a temperature range of -55 to 125°C, it is ideal for chip carrier IC applications requiring high insulation resistance and dielectric voltage withstand capabilities.
ICF-308-T-O by Samtec

ICF-308-T-O

Samtec

Samtec's ICF-308-T-O is a Chip Carrier IC Socket with 8 contacts, 0.1" pitch, and Liquid Crystal Polymer housing. It is used for DIP8 devices in applications requiring -55 to 125°C operating temperature range and surface mount termination.
173-10-318-00-001000 by Mill-max Mfg

173-10-318-00-001000

Mill-max Mfg

173-10-318-00-001000 by Mill-max Mfg is a PLASTIC IC SOCKET for DIP18 devices with 18 contacts. Features GOLD OVER NICKEL contact finish, RECTANGLE contact config. Ideal for Chip Carrier IC & Component Sockets applications.