TE Connectivity - 1419111-2

  1. Home
  2. TE Connectivity - 1419111-2
1419111-2 by TE Connectivity

Image shown is a representation only.

Manufacturer TE Connectivity
Manufacturer's Part Number 1419111-2
Description RELAY SOCKET; Housing Material: STAINLESS STEEL; Termination Type: SOLDER; Contact Material: NOT APPLICABLE; Contact Finish (Mating): NOT APPLICABLE;
Datasheet 1419111-2 Datasheet
NAME DESCRIPTION
IC Socket Type: Relay Socket
Termination Type: Solder
Housing Material: Stainless Steel
Plant 5!
Your quote plants 5 trees.

Popular Products

Category Top Products

540-88-044-17-400-TR by Preci-dip Sa

540-88-044-17-400-TR

Preci-dip Sa

IC SOCKET; Device Type Used On: PLCC44; Housing Material: PPS THERMOPLASTIC; Additional Features: STANDARD: UL 94V-0, LOW PROFILE; No. of Contacts: 44; Contact Material: NOT SPECIFIED;
116-43-314-41-008000 by Mill-max Mfg

116-43-314-41-008000

Mill-max Mfg

116-43-314-41-008000 by Mill-max Mfg is a PLASTIC IC SOCKET for DIP14 devices with 14 contacts. Featuring MATTE TIN OVER NICKEL finish, it is ideal for Chip Carrier IC & Component Sockets applications due to its RECTANGLE contact configuration.
PY08-Y1 by Omron

PY08-Y1

Omron

RELAY SOCKET; Contact Material: NOT SPECIFIED; Contact Finish (Termination): NOT APPLICABLE; Contact Finish (Mating): NOT SPECIFIED; No. of Contacts: 8;
MVAT-209-DG-17 by Samtec

MVAT-209-DG-17

Samtec

IC SOCKET; Device Type Used On: PGA209; No. of Contacts: 209; Additional Features: PGA SOCKET; Contact Finish (Termination): GOLD; JESD-609 Code: e4;
173-10-308-00-001000 by Mill-max Mfg

173-10-308-00-001000

Mill-max Mfg

173-10-308-00-001000 by Mill-max Mfg is a PLASTIC IC SOCKET for DIP8 devices with 8 contacts. It features GOLD OVER NICKEL contact finish, RECTANGLE contact configuration, and is ideal for Chip Carrier IC & Component Sockets applications.
PY11QN2-Y1 by Omron

PY11QN2-Y1

Omron

RELAY SOCKET;
40-6552-11 by Aries Electronics

40-6552-11

Aries Electronics

Aries Electronics 40-6552-11 is a DIP42 IC socket with 40 contacts made of beryllium copper. The housing material is polyphenylene sulfide, and the contact finish includes gold over nickel. Ideal for chip carrier applications requiring reliable connections in electronic devices.
SY4S-05C by Idec

SY4S-05C

Idec

RELAY SOCKET;
RSL116091 by Amphenol

RSL116091

Amphenol

RELAY SOCKET; Housing Material: POLYETHERIMIDE; Manufacturer Series: RSL; JESD-609 Code: e4; Contact Finish (Termination): GOLD; Contact Finish (Mating): GOLD;
IC149-100-025-B5 by Fujitsu

IC149-100-025-B5

Fujitsu

Fujitsu IC149-100-025-B5 is a 100-contact QFP100 chip carrier socket with POLYPHENYLENE SULPHIDE housing. It features BERYLLIUM COPPER contacts finished in GOLD (Au) with Nickel (Ni) barrier. Ideal for IC SOCKET applications requiring reliable connections and durability.
27E630 by TE Connectivity

27E630

TE Connectivity

IC SOCKET; Housing Material: PHENOLIC; Termination Type: SOLDER; No. of Contacts: 22; Contact Material: NOT APPLICABLE; Contact Finish (Mating): NOT APPLICABLE;
27E166 by TE Connectivity

27E166

TE Connectivity

TE Connectivity's 27E166 is a GLASS FILLED POLYESTER Chip Carrier IC Socket with SCREW termination. It features 14 RND PIN-SKT contacts and is designed for use on RELAY devices. Ideal for high-performance electronic applications.
818-22-024-10-002101 by Mill-max Mfg

818-22-024-10-002101

Mill-max Mfg

IC SOCKET; Device Type Used On: DIP24; Housing Material: PLASTIC; Additional Features: STANDARD: UL 94V-0; Contact Material: NOT SPECIFIED; Contact Finish (Termination): GOLD OVER NICKEL;
MT78745- by TE Connectivity

MT78745-

TE Connectivity

IC SOCKET; Housing Material: POLYAMIDE; Contact Finish (Mating): NOT SPECIFIED; Termination Type: SCREW; No. of Contacts: 8; Contact Material: NOT SPECIFIED;
SM2S-05C by Idec

SM2S-05C

Idec

RELAY SOCKET;
ICO-314-STT by Samtec

ICO-314-STT

Samtec

ICO-314-STT by Samtec is a DIP14 IC socket with 14 contacts, 7.62mm PCB row spacing, and rectangular contact pattern. It uses beryllium copper contacts with tin over nickel finish for a current rating of 1A. Ideal for applications requiring a dielectric voltage withstand of 1400VAC in temperatures ranging from -55 to 105°C.
XR2T-2401-N by Omron

XR2T-2401-N

Omron

IC SOCKET; Contact Finish (Mating): GOLD (30); Contact Material: BERYLLIUM COPPER; Manufacturer Series: XR2T; JESD-609 Code: e4; Contact Finish (Termination): GOLD;
HLT-1507-T-R by Samtec

HLT-1507-T-R

Samtec

The Samtec HLT-1507-T-R is a plastic IC socket with 105 brass contacts, featuring Tin over Nickel mating finish. Designed for use on PGA105 devices, it offers reliable connectivity and durability in chip carrier applications.
XR2T-2473-N by Omron

XR2T-2473-N

Omron

IC SOCKET; Contact Finish (Mating): GOLD (10); Manufacturer Series: XR2T; Contact Finish (Termination): GOLD; JESD-609 Code: e4; Contact Material: BERYLLIUM COPPER;
2-1571586-9 by TE Connectivity

2-1571586-9

TE Connectivity

TE Connectivity 2-1571586-9 is a DIP28 IC socket with 28 contacts. It features a PCB contact row spacing of 15.24mm, rectangular contact pattern, and thermoplastic housing material. Ideal for applications requiring a mating contact pitch of 0.1 inch, solder termination, and current rating of 3A in temperatures ranging from -55 to 105°C.