TE Connectivity - 1419111-2

  1. Home
  2. TE Connectivity - 1419111-2
1419111-2 by TE Connectivity

Image shown is a representation only.

Manufacturer TE Connectivity
Manufacturer's Part Number 1419111-2
Description RELAY SOCKET; Housing Material: STAINLESS STEEL; Termination Type: SOLDER; Contact Material: NOT APPLICABLE; Contact Finish (Mating): NOT APPLICABLE;
Datasheet 1419111-2 Datasheet
NAME DESCRIPTION
IC Socket Type: Relay Socket
Termination Type: Solder
Housing Material: Stainless Steel
Plant 5!
Your quote plants 5 trees.

Popular Products

Category Top Products

PT11QN by Omron

PT11QN

Omron

RELAY SOCKET; Contact Finish (Mating): NOT APPLICABLE; No. of Contacts: 11; Contact Material: NOT APPLICABLE;
311-99-113-41-001000 by Mill-max Mfg

311-99-113-41-001000

Mill-max Mfg

Mill-max Mfg 311-99-113-41-001000 is a PLASTIC IC SOCKET for SIP13 devices with 13 contacts. Features TIN LEAD (200) mating finish and Tin/Lead termination. Ideal for Chip Carrier IC & Component Sockets applications.
110-93-632-41-001000 by Mill-max Mfg

110-93-632-41-001000

Mill-max Mfg

Mill-max Mfg's 110-93-632-41-001000 is a Chip Carrier IC Socket with POLYETHYLENE housing and BERYLLIUM COPPER contacts. Featuring 32 contacts with Tin/Lead finish, it is designed for DIP32 devices. Ideal for applications requiring reliable connections in electronic circuits.
27E462 by TE Connectivity

27E462

TE Connectivity

IC SOCKET; Housing Material: PHENOLIC; No. of Contacts: 22; Contact Material: NOT APPLICABLE; JESD-609 Code: e3; Contact Finish (Mating): NOT APPLICABLE;
ZA8-20-2-1.00-Z-10 by Samtec

ZA8-20-2-1.00-Z-10

Samtec

IC SOCKET;
XR2A-1625 by Omron

XR2A-1625

Omron

IC SOCKET; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED;
60431011 by Fci

60431011

Fci

RELAY SOCKET; Housing Material: POLYBUTYLENE TEREPHTHALATE; Contact Finish (Mating): NOT SPECIFIED; No. of Contacts: 8; Additional Features: POLARIZED;
27E891 by TE Connectivity

27E891

TE Connectivity

TE Connectivity's 27E891 is a POLYAMIDE chip carrier socket with SCREW termination, suitable for RELAY devices. Featuring 8 BLADE PIN-SKT contacts, it is an IC SOCKET type ideal for relay applications.
08-3518-10 by Aries Electronics

08-3518-10

Aries Electronics

Aries Electronics 08-3518-10 is a DIP8 IC socket with 0.1" contact pitch, suitable for surface mount termination. It features brass contacts with gold finish, rated at 3A current. Ideal for applications requiring chip carrier sockets on PCBs with rectangular contact pattern and 7.62mm row spacing.
326-93-103-41-003000 by Mill-max Mfg

326-93-103-41-003000

Mill-max Mfg

Mill-max Mfg's 326-93-103-41-003000 is a PLASTIC IC SOCKET for SIP3 devices with 3 contacts. Features GOLD (30) OVER NICKEL (100) mating finish and Tin/Lead termination. Ideal for Chip Carrier IC & Component Sockets applications.
XR2T-2467-N by Omron

XR2T-2467-N

Omron

IC SOCKET; Manufacturer Series: XR2T; Contact Finish (Mating): GOLD FLASH; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4; Contact Finish (Termination): GOLD FLASH;
110-87-306-41-001101 by Preci-dip Sa

110-87-306-41-001101

Preci-dip Sa

110-87-306-41-001101 by Preci-dip Sa is a DIP6 IC socket with 6 contacts, rated for 1A current. It features a PCB contact row spacing of 7.62mm and housing material made of POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER. This socket is ideal for applications requiring a dielectric withstand voltage of 1400VAC and operating temperatures ranging from -55 to 125°C.
110-87-324-41-001101 by Preci-dip Sa

110-87-324-41-001101

Preci-dip Sa

110-87-324-41-001101 by Preci-dip Sa is a DIP24 IC socket with 24 contacts, rated for 1A current. It features Beryllium Copper contact material with Gold Flash finish and operates b/w -55°C to 125°C. Suitable for chip carrier ICs, it has a PCB contact row spacing of 7.62mm and Polycyclohexydimethylene Terephthalate-Polyester housing material.
264-1300-29-0602J by 3m Electronic Products Division

264-1300-29-0602J

3m Electronic Products Division

The 3M Electronic Products Division's 264-1300-29-0602J is a Chip Carrier IC Socket with GLASS FILLED POLYSULFONE housing and BERYLLIUM COPPER contacts. It features DIP64 device compatibility, GOLD (30) OVER NICKEL (50) mating finish, and Gold (Au) - with Nickel (Ni) termination finish. Ideal for applications requiring reliable connections in electronic circuits.
P2R-05P by Omron

P2R-05P

Omron

RELAY SOCKET; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED; No. of Contacts: 5; Contact Finish (Termination): NOT APPLICABLE;
PGA-280 by Robinson Nugent

PGA-280

Robinson Nugent

IC SOCKET; Device Type Used On: PGA280; Housing Material: POLYESTER; Additional Features: STANDARD: UL 94V-0; No. of Contacts: 280; Manufacturer Series: PGA;
110-87-632-41-001101 by Preci-dip Sa

110-87-632-41-001101

Preci-dip Sa

110-87-632-41-001101 by Preci-dip Sa is a DIP32 IC socket with 32 contacts, rated for 1A current. It features Beryllium Copper contact material with Gold Flash finish and Polycyclohexydimethylene Terephthalate-Polyester housing. With a PCB contact row spacing of 15.24mm, it operates b/w -55°C to 125°C, making it ideal for various electronic applications requiring reliable connections.
2833589 by Phoenix Contact

2833589

Phoenix Contact

RELAY SOCKET;
3-1437530-5 by TE Connectivity

3-1437530-5

TE Connectivity

IC SOCKET; Device Type Used On: SIP20; Housing Material: POLYESTER; Contact Finish (Mating): NOT APPLICABLE; Additional Features: UL94V-0; No. of Contacts: 20;
1-1814655-1 by TE Connectivity

1-1814655-1

TE Connectivity

TE Connectivity's 1-1814655-1 is a SIP16 IC socket with THERMOPLASTIC POLYESTER housing. Featuring 16 contacts, it has a current rating of 1A and operates b/w -55°C to 125°C. Ideal for applications requiring straight mounting and solder termination, with a terminal pitch of 2.54mm.