Mill-max Mfg - 415-43-236-41-003000

  1. Home
  2. Mill-max Mfg - 415-43-236-41-003000
415-43-236-41-003000 by Mill-max Mfg

Image shown is a representation only.

Manufacturer Mill-max Mfg
Manufacturer's Part Number 415-43-236-41-003000
Description IC SOCKET; Device Type Used On: SIP36; Housing Material: POLYETHYLENE; No. of Contacts: 36; JESD-609 Code: e3; Contact Finish (Mating): NOT SPECIFIED;
Datasheet 415-43-236-41-003000 Datasheet
NAME DESCRIPTION
IC Socket Type: IC Socket
Contact Config: Rectangle
Contact Finish (Termination): Tin
Housing Material: Polyethylene (PE)
Device Type Used On: SIP36
Additional Features: Ultra Low Profile
JESD-609 Code: e3
No. of Contacts: 36
Plant 5!
Your quote plants 5 trees.

Popular Products

Category Top Products

P6DS-04P by Omron

P6DS-04P

Omron

RELAY SOCKET; Contact Finish (Termination): NOT SPECIFIED; No. of Contacts: 4; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED;
342-10-142-00-591000 by Mill-max Mfg

342-10-142-00-591000

Mill-max Mfg

Mill-max Mfg 342-10-142-00-591000 is a POLYETHYLENE IC SOCKET for SIP42 devices with 42 contacts. Features GOLD OVER NICKEL finish, RECTANGLE contact config. Ideal for Chip Carrier IC & Component Sockets applications.
27E462 by TE Connectivity

27E462

TE Connectivity

IC SOCKET; Housing Material: PHENOLIC; No. of Contacts: 22; Contact Material: NOT APPLICABLE; JESD-609 Code: e3; Contact Finish (Mating): NOT APPLICABLE;
PT08QN by Omron

PT08QN

Omron

RELAY SOCKET; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED; No. of Contacts: 8; Contact Finish (Termination): NOT APPLICABLE;
HLS-1902-S-22-L by Samtec

HLS-1902-S-22-L

Samtec

Samtec's HLS-1902-S-22-L is a POLYETHYLENE chip carrier IC socket with 38 contacts, GOLD finish for mating and termination. Designed for DIP38 devices, it offers reliable connectivity in various electronic applications.
XR2T-2811-N by Omron

XR2T-2811-N

Omron

IC SOCKET; Contact Finish (Termination): GOLD; Contact Material: BERYLLIUM COPPER; Manufacturer Series: XR2T; Contact Finish (Mating): GOLD (10); JESD-609 Code: e4;
110-87-640-41-001101 by Preci-dip Sa

110-87-640-41-001101

Preci-dip Sa

110-87-640-41-001101 by Preci-dip Sa is a DIP40 IC socket with 40 contacts, rated for 1A current. It features Beryllium Copper contact material with Gold Flash finish and Tin termination. With a PCB contact row spacing of 15.24mm, it operates b/w -55°C to 125°C, making it ideal for chip carrier applications.
818-22-016-10-000101 by Mill-max Mfg

818-22-016-10-000101

Mill-max Mfg

IC SOCKET; Device Type Used On: DIP16; Housing Material: PLASTIC; Contact Finish (Mating): NOT SPECIFIED; JESD-609 Code: e4; Contact Finish (Termination): GOLD OVER NICKEL;
XR2B-3211-N by Omron

XR2B-3211-N

Omron

IC SOCKET; JESD-609 Code: e4; Contact Finish (Termination): GOLD; Contact Material: BERYLLIUM COPPER; Contact Finish (Mating): GOLD (10); Manufacturer Series: XR2;
XR2C-3221-N by Omron

XR2C-3221-N

Omron

IC SOCKET; Contact Finish (Termination): GOLD FLASH; Contact Finish (Mating): GOLD FLASH; JESD-609 Code: e4; Manufacturer Series: XR2; Contact Material: BERYLLIUM COPPER;
XR2A-4205 by Omron

XR2A-4205

Omron

IC SOCKET; Manufacturer Series: XR2;
218-7223-55-1902 by 3m Electronic Products Division

218-7223-55-1902

3m Electronic Products Division

218-7223-55-1902 by 3M Electronic Products Division is a SOIC18 IC socket with POLYETHERSULFONE housing and BERYLLIUM COPPER contacts. It features 18 gold-over-nickel contacts for mating and termination, making it ideal for chip carrier IC applications.
27E419 by TE Connectivity

27E419

TE Connectivity

IC SOCKET; Housing Material: NYLON; Contact Finish (Mating): NOT APPLICABLE; No. of Contacts: 11; Contact Material: NOT APPLICABLE; Termination Type: SOLDER;
232-1285-09-0602J by 3m Electronic Products Division

232-1285-09-0602J

3m Electronic Products Division

232-1285-09-0602J by 3M is a DIP32 IC socket with GLASS FILLED POLYSULFONE housing and BERYLLIUM COPPER contacts. It features 32 gold-over-nickel contacts for reliable connections. Ideal for chip carrier ICs, this socket ensures secure component mounting in electronic devices.
CQF100-138A by Texas Instruments

CQF100-138A

Texas Instruments

IC SOCKET; Device Type Used On: QFP100; Housing Material: GLASS FILLED POLYETHERIMIDE; Manufacturer Series: CQF; No. of Contacts: 100;
4-1571552-4 by TE Connectivity

4-1571552-4

TE Connectivity

TE Connectivity 4-1571552-4 is a DIP16 IC SOCKET with 16 contacts, rated at 3A current. It features a PCB contact row spacing of 7.62mm and rectangular pattern, suitable for applications requiring a mating contact pitch of 0.1 inch. The housing material is thermoplastic, ensuring reliable performance in temperatures ranging from -55°C to 105°C.
SS-104-G-22-N by Samtec

SS-104-G-22-N

Samtec

SS-104-G-22-N by Samtec is a Chip Carrier IC Socket with 4 contacts, rated at 1A current. It features a rectangular PCB contact pattern, glass-filled polyester housing material, and gold finish with nickel barrier. This socket is used on SIP4 devices and operates b/w -65°C to 125°C, making it ideal for various electronic applications.
PY11QN2 by Omron

PY11QN2

Omron

RELAY SOCKET;
8134-HC-5P3 by Augat

8134-HC-5P3

Augat

IC SOCKET; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Rating (Current): 5 A; Termination Type: PRESS FIT; No. of Contacts: 1;
XR2B-1601-N by Omron

XR2B-1601-N

Omron

IC SOCKET; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4; Manufacturer Series: XR2; Contact Finish (Mating): GOLD (30); Contact Finish (Termination): GOLD;