Fischer Elektronik & Kg - TF58

390262-5 by Tyco Electronics Amp is a DIP40 IC socket with GLASS FILLED POLYBUTYLENE TEREPHTHALATE housing and PHOSPHOR BRONZE contacts. It features 40 contacts with TIN LEAD finish for mating and termination. Ideal for use in Chip Carrier IC applications.

APH-1016-T-R by Samtec is a Chip Carrier IC Socket with POLYETHYLENE housing and BRASS contacts. Featuring 16 contacts with TIN OVER NICKEL finish, it is designed for DIP16 devices. Ideal for applications requiring reliable rectangular contact configuration in electronic assemblies.

IC SOCKET; Device Type Used On: SIP58; Housing Material: PLASTIC; JESD-609 Code: e4; Additional Features: STANDARD: UL 94V-0; Contact Finish (Termination): GOLD OVER NICKEL;

Mill-max Mfg 370-10-107-00-001000 is a POLYETHYLENE IC SOCKET for SIP7 devices with 7 contacts. Features GOLD OVER NICKEL finish, RECTANGLE contact config. Ideal for Chip Carrier IC & Component Sockets applications.

110-83-314-41-001101 by Preci-dip Sa is a DIP14 IC socket with 14 contacts, rated for 1A current. It features Beryllium Copper contact material, Gold mating finish, and Tin termination finish. With a PCB contact row spacing of 7.62mm, it has a dielectric voltage of 1400VAC and operates b/w -55°C to 125°C. Ideal for chip carrier IC applications due to its high insulation resistance and durable housing material.

TE Connectivity's 808-AG11D is a DIP8 IC socket with 8 contacts, rated at 3A current. It features a rectangular PCB contact pattern with 7.62mm row spacing and polyester housing material. Suitable for applications requiring a mating contact pitch of 0.1 inch, it operates b/w -55°C to 125°C temperature range.

RELAY SOCKET;

416-43-226-41-008000 by Mill-max Mfg is a PLASTIC IC SOCKET for DIP26 devices with 26 contacts and TIN finish. It is used in Chip Carrier IC & Component Sockets applications due to its RECTANGLE contact configuration.

TE Connectivity's 3334485008 is a RELAY SOCKET with SCREW termination. Featuring 5 contacts, it has a body size of 1.417" x 1.433". Ideal for chip carrier ICs, this socket offers straight mounting style for secure connections in various electronic applications.

110-87-306-41-001101 by Preci-dip Sa is a DIP6 IC socket with 6 contacts, rated for 1A current. It features a PCB contact row spacing of 7.62mm and housing material made of POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER. This socket is ideal for applications requiring a dielectric withstand voltage of 1400VAC and operating temperatures ranging from -55 to 125°C.

TE Connectivity's 27E152 is a RECTANGULAR Chip Carrier IC Socket with POLYESTER housing. It has 16 BLADE PIN-SKT contacts, rated for 10A current on RELAY devices. With 1400VAC dielectric voltage and high insulation resistance, it is ideal for straight mounting on PCBs.

The 3m Electronic Products Division's 251-5949-01-0602 is a Chip Carrier IC Socket with GLASS FILLED POLYSULFONE housing. It has 51 BERYLLIUM COPPER contacts finished in GOLD over NICKEL for ZIP51 devices. Ideal for applications requiring reliable connections and durability.

Keystone Electronics 4590 is a TO-5 transistor socket with GLASS FILLED POLYESTER housing. Featuring 3 RND PIN-SKT contacts, it has a 0.165" body depth and SOLDER termination. Ideal for chip carrier IC applications requiring a STRAIGHT mounting style.

ICO-314-STT by Samtec is a DIP14 IC socket with 14 contacts, 7.62mm PCB row spacing, and rectangular contact pattern. It uses beryllium copper contacts with tin over nickel finish for a current rating of 1A. Ideal for applications requiring a dielectric voltage withstand of 1400VAC in temperatures ranging from -55 to 105°C.

Mill-max Mfg's 551-10-155-18-121004 is a PGA155 IC socket with 155 contacts. It features gold (Au) mating finish over nickel (Ni) and termination finish, housed in POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER. Ideal for chip carrier applications.

RELAY SOCKET;

IC SOCKET; Device Type Used On: SIP20; Housing Material: POLYESTER; Contact Finish (Mating): NOT APPLICABLE; Additional Features: UL94V-0; No. of Contacts: 20;

IC SOCKET; Housing Material: POLYCARBONATE; Contact Material: NOT APPLICABLE; Contact Finish (Mating): NOT APPLICABLE; Termination Type: SOLDER;

IC SOCKET; Device Type Used On: DIP20; Housing Material: POLYESTER; Contact Material: NOT SPECIFIED; Additional Features: VERTICAL MOUNT DIP SOCKET; No. of Contacts: 20;

IC SOCKET; Contact Finish (Termination): TIN LEAD; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED;