TE Connectivity - 828-AG11D-ESL-LF

TE Connectivity's 27E892 is a POLYAMIDE chip carrier socket with 11 BLADE PIN-SKT contacts for RELAY devices. Featuring SCREW termination, it is ideal for IC SOCKET applications.

Amphenol's 69802-432LF is a PLCC32 IC socket with POLYPHENYLENE SULFIDE housing. Featuring 32 contacts, it has a current rating of 1A and operates b/w -55°C to 125°C. With surface mount termination and high insulation resistance, it is ideal for chip carrier applications.

Samtec's ICA-314-JGG-H is a 14-contact IC socket with brass contacts and gold over nickel mating finish. It is designed for DIP14 devices, featuring a rectangular contact configuration. Ideal for chip carrier IC applications requiring reliable connections with gold termination finish.

TE Connectivity's 1825575-2 is a Chip Carrier IC Socket with 8 contacts, BE-CU material, and SN finish. It has a PCB contact row spacing of 17.78mm and mating pitch of 0.1 inch, suitable for DIP8 devices. Ideal for surface mount applications in electronics, it operates b/w -55°C to 125°C with a current rating of 1A.

IC SOCKET; Housing Material: POLYESTER; Contact Material: NOT APPLICABLE; Termination Type: SOLDER; No. of Contacts: 10; Contact Finish (Mating): NOT APPLICABLE;

RELAY SOCKET;

IC SOCKET;

210-93-308-41-001000 by Mill-max Mfg is a Chip Carrier IC Socket with PCT Polyester housing and Beryllium Copper contacts. It is designed for DIP8 devices, featuring 8 contacts with Tin/Lead finish. Ideal for applications requiring reliable connection in electronic circuits.

IC SOCKET; Contact Finish (Termination): TIN LEAD; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED;

TE Connectivity 1-390261-3 is a Chip Carrier IC Socket with 14 contacts, rated at 1A current. It has a PCB contact row spacing of 7.62mm and operates b/w -40°C to 105°C. Ideal for DIP14 devices, it features a rectangular contact pattern and uses solder termination.

Mill-max Mfg 415-13-222-41-001000 is a POLYETHYLENE IC SOCKET for SIP22 devices with 22 GOLD contacts. Its RECTANGLE contact config makes it ideal for Chip Carrier IC & Component Sockets applications.

IC SOCKET; JESD-609 Code: e4; Contact Material: BERYLLIUM COPPER; Manufacturer Series: XR2A; Contact Finish (Mating): GOLD (30); Contact Finish (Termination): GOLD;

TE Connectivity's 6-1415035-1 is an IC socket with 8 contacts, rated for 16A current. With a body size of 3.031" x 0.622" x 2.421", it operates b/w -40°C to 70°C and uses screw termination. Ideal for chip carrier ICs on relays.

RELAY SOCKET; Device Type Used On: RELAY; Contact Finish (Mating): NOT APPLICABLE; No. of Contacts: 8; Contact Material: NOT APPLICABLE;

110-83-314-41-001101 by Preci-dip Sa is a DIP14 IC socket with 14 contacts, rated for 1A current. It features Beryllium Copper contact material, Gold mating finish, and Tin termination finish. With a PCB contact row spacing of 7.62mm, it has a dielectric voltage of 1400VAC and operates b/w -55°C to 125°C. Ideal for chip carrier IC applications due to its high insulation resistance and durable housing material.

Mill-max Mfg 410-93-220-10-001000 is a Chip Carrier IC Socket with 20 contacts, staggered pattern, and 2.54mm pitch. It uses beryllium copper contacts for DIP20 devices, rated at 3A current. Ideal for PCBs with straight mounting style and operating temperatures from -55 to 125°C.

IC SOCKET; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4; Contact Finish (Termination): GOLD; Contact Finish (Mating): GOLD (30);

D2818-42 by Harwin PLC is a Chip Carrier IC Socket with 18 contacts, rated for 1A current. Made of plastic, it has a dielectric voltage of 1400VAC and operates b/w -55°C to 125°C. Ideal for DIP18 devices, this socket features solder termination and round pin contact style.

IC SOCKET; Device Type Used On: QFP100; Housing Material: GLASS FILLED POLYETHERIMIDE; Manufacturer Series: CQF; No. of Contacts: 100;

Samtec's ICF-328-T-O-TR is a Chip Carrier IC Socket with 28 contacts, featuring a PCB contact row spacing of 7.62mm and rectangular contact pattern. It utilizes liquid crystal polymer housing material and has a mating contact pitch of 0.1 inch. Ideal for DIP28 devices, it offers surface mount termination and operates b/w -55°C to 125°C.