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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | 935293007118 |
| Description | MICROPROCESSOR CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE; Terminal Finish: NICKEL PALLADIUM GOLD; |
| Datasheet | 935293007118 Datasheet |
| In Stock | 997 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 2.7 V |
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 3.3 V |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Maximum Seated Height: | 1 mm |
| Surface Mount: | YES |
| Terminal Finish: | NICKEL PALLADIUM GOLD |
| No. of Terminals: | 32 |
| Terminal Position: | QUAD |
| Package Style (Meter): | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Technology: | CMOS |
| JESD-30 Code: | S-PQCC-N32 |
| Package Shape: | SQUARE |
| Terminal Form: | NO LEAD |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | HVQCCN |
| Width: | 5 mm |
| Moisture Sensitivity Level (MSL): | 1 |
| Peripheral IC Type: | MICROPROCESSOR CIRCUIT |
| Maximum Supply Voltage: | 5.5 V |
| JESD-609 Code: | e4 |
| Minimum Operating Temperature: | -25 Cel |
| Package Equivalence Code: | LCC32,.2SQ,20 |
| Length: | 5 mm |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | .5 mm |
