NXP Semiconductors - 935338887557

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935338887557 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number 935338887557
Description SYSTEM ON CHIP; Terminal Finish: TIN SILVER COPPER; Peak Reflow Temperature (C): 250; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 30; JESD-609 Code: e1;
Datasheet 935338887557 Datasheet
In Stock1,999
NAME DESCRIPTION
Peripheral IC Type: SYSTEM ON CHIP
Maximum Time At Peak Reflow Temperature (s): 30
Peak Reflow Temperature (C): 250
Terminal Finish: TIN SILVER COPPER
JESD-609 Code: e1
Moisture Sensitivity Level (MSL): 3
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