NXP Semiconductors - 935378336557

CY8C27443-24PVXIT by Infineon: 8-bit, 24 MHz CPU with 16384 ROM words and 256 RAM bytes. Ideal for industrial applications with I2C and USB bus compatibility. Package style: small outline, shrink pitch; terminal form: gull wing; max supply voltage: 5.25 V.

Multifunction Peripherals; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SSOP; Package Shape: RECTANGULAR;

ZPSD502B1-70J by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at a max voltage of 5.5V. It features 512 RAM words, supports various bus types, and is ideal for embedded applications. Its compact chip carrier design ensures efficient space utilization in electronic systems.

MULTIFUNCTION PERIPHERAL; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE;

SYSTEM ON CHIP; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3;

MCIMX535DVV2C by NXP Semiconductors is a CMOS technology chip with 529 terminals in a square package. It operates b/w 1.3-1.4 V, has a terminal pitch of 0.8 mm, and can withstand peak reflow temperature of 260°C. Ideal for multi-functional peripherals requiring fine-pitch grid array packaging.

Multifunction Peripherals; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE;

CY8C4125AZI-M443 by Infineon Technologies is a versatile peripheral IC with 2048 RAM words, operating at up to 48 MHz clock frequency. Ideal for industrial applications, it offers 38 I/O lines and supports various bus compatibilities like I2C, IRDA, LIN, SPI, and UART. With a low profile flatpack package style and Gull Wing terminal form, this CMOS technology chip ensures reliable performance in a compact design.

ZPSD512B0-70J by STMicroelectronics is a versatile CMOS peripheral with a 16-bit address bus and 40 I/O lines. It operates at 4.5-5.5V, supports up to 36 MHz clock frequency, and is ideal for applications in embedded systems requiring compact design.

Multifunction Peripherals; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SSOP; Package Shape: RECTANGULAR;

CY8C5467AXI-LP108 by Infineon is a multi-functional peripheral with 100 terminals, operating at -40 to 85 °C. It features 16384 RAM words, 1048576 ROM bits, and supports I2C, USB, PS/2 buses. Ideal for industrial applications requiring a low-profile package with a max clock frequency of 33 MHz.

MULTIFUNCTION PERIPHERAL;

ZPSD503B1-70JI by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at 5V. It features a max clock frequency of 36 MHz, ideal for industrial applications. With a compact chip carrier design, it supports various bus systems.

LS1046ASE8P1A by NXP Semiconductors is a multi-functional peripheral with 64-bit external data bus width, 780 terminals in a square package shape, and CMOS technology. It is suitable for applications requiring I2C, PCI, SPI, UART, or USB bus compatibility.

Multifunction Peripherals; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE;

The Texas Instruments CC1111F16RSP is a CMOS chip carrier with 36 terminals, 0.5mm pitch, and 0.9mm seated height. It can withstand peak reflow temperatures of 260°C for up to 30 seconds. Ideal for applications requiring multi-functional peripherals in compact spaces.

MULTIFUNCTION PERIPHERAL;

Multifunction Peripherals; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SSOP; Package Shape: RECTANGULAR;

MULTIFUNCTION PERIPHERAL;

PSD512B1-70JI by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at a max voltage of 5.5V. It features 1024 RAM words, supports various bus types, and functions effectively in industrial applications from -40 °C to 85°C. Its compact chip carrier design ensures efficient integration in electronic systems.