NXP Semiconductors - BAP50-03,135

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BAP50-03,135 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number BAP50-03,135
Description PIN DIODE; Surface Mount: YES; Peak Reflow Temperature (C): 260; JESD-609 Code: e3; Minimum Breakdown Voltage: 50 V; Terminal Finish: TIN;
Datasheet BAP50-03,135 Datasheet
In Stock163,975
NAME DESCRIPTION
Diode Resistive Test Frequency: 100 MHz
Reverse Test Voltage: 1 V
Maximum Time At Peak Reflow Temperature (s): 30
Diode Type: PIN DIODE
Diode Resistive Test Current: .5 mA
Sub-Category: PIN Diodes
Surface Mount: YES
Terminal Finish: TIN
JESD-609 Code: e3
Nominal Diode Capacitance: .55 pF
Minimum Breakdown Voltage: 50 V
Maximum Operating Temperature: 150 Cel
Maximum Diode Forward Resistance: 40 ohm
Peak Reflow Temperature (C): 260
Moisture Sensitivity Level (MSL): 1
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