BAP50LX by NXP Semiconductors | Diodes

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Manufacturer	NXP Semiconductors
Manufacturer's Part Number	BAP50LX
Description	PIN DIODE; Terminal Position: BOTTOM; Terminal Form: NO LEAD; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Datasheet	BAP50LX Datasheet
In Stock	343

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Time At Peak Reflow Temperature (s):	30
Config:	SINGLE
Diode Type:	PIN DIODE
Frequency Band:	S BAND
Surface Mount:	YES
Terminal Finish:	TIN
No. of Terminals:	2
Terminal Position:	BOTTOM
Maximum Diode Capacitance:	.55 pF
Package Style (Meter):	CHIP CARRIER
Technology:	POSITIVE-INTRINSIC-NEGATIVE
JESD-30 Code:	R-PBCC-N2
No. of Elements:	1
Package Shape:	RECTANGULAR
Terminal Form:	NO LEAD
Maximum Operating Temperature:	150 Cel
Maximum Diode Forward Resistance:	5 ohm
Nominal Minority Carrier Lifetime:	1 us
JESD-609 Code:	e3
Minimum Operating Temperature:	-65 Cel
Diode Element Material:	SILICON
Qualification:	Not Qualified
Maximum Power Dissipation:	.15 W
Peak Reflow Temperature (C):	260

Pricing (USD)

Qty.	Unit Price	Ext. Price
343	-	-

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