NXP Semiconductors - BGD602D

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BGD602D by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number BGD602D
Description WIDE BAND HIGH POWER; Package Body Material: PLASTIC/EPOXY; Technology: HYBRID; Power Supplies (V): 24; Maximum Operating Frequency: 600 MHz; Minimum Operating Temperature: -20 Cel;
Datasheet BGD602D Datasheet
In Stock300
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Construction: MODULE
Minimum Operating Frequency: 40 MHz
Sub-Category: RF/Microwave Amplifiers
Maximum Supply Current: 440 mA
Minimum Operating Temperature: -20 Cel
Package Equivalence Code: SOT-115C
Technology: HYBRID
Characteristic Impedance: 75 ohm
Additional Features: LOW NOISE, HIGH RELIABILITY
Maximum Operating Temperature: 100 Cel
Maximum Operating Frequency: 600 MHz
RF or Microwave Device Type: WIDE BAND HIGH POWER
Gain: 18.5 dB
Power Supplies (V): 24
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