NXP Semiconductors - BGF802-20,127

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BGF802-20,127 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number BGF802-20,127
Description NARROW BAND HIGH POWER; Package Body Material: PLASTIC/EPOXY; Technology: HYBRID; Minimum Operating Frequency: 869 MHz; Construction: COMPONENT; Minimum Operating Temperature: -20 Cel;
Datasheet BGF802-20,127 Datasheet
In Stock3,921
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Construction: COMPONENT
Minimum Operating Frequency: 869 MHz
Sub-Category: RF/Microwave Amplifiers
Maximum Supply Current: 320 mA
Minimum Operating Temperature: -20 Cel
No. of Functions: 1
Maximum Voltage Standing Wave Ratio: 2
Maximum Input Power (CW): 20 dBm
Package Equivalence Code: FLNG,1.6"H.SPACE
Technology: HYBRID
Characteristic Impedance: 50 ohm
Maximum Operating Temperature: 90 Cel
Maximum Operating Frequency: 894 MHz
RF or Microwave Device Type: NARROW BAND HIGH POWER
Gain: 28 dB
Power Supplies (V): 26
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