NXP Semiconductors - BGM1013

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BGM1013 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number BGM1013
Description WIDE BAND LOW POWER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; Construction: COMPONENT;
Datasheet BGM1013 Datasheet
In Stock863
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Construction: COMPONENT
Minimum Operating Frequency: 100 MHz
Sub-Category: RF/Microwave Amplifiers
Maximum Supply Current: 33 mA
Terminal Finish: Tin (Sn)
JESD-609 Code: e3
Minimum Operating Temperature: -40 Cel
Mounting Feature: SURFACE MOUNT
No. of Functions: 1
No. of Terminals: 6
Maximum Input Power (CW): -10 dBm
Package Equivalence Code: TSSOP6,.08
Technology: BIPOLAR
Characteristic Impedance: 50 ohm
Additional Features: LOW NOISE
Maximum Operating Temperature: 85 Cel
Maximum Operating Frequency: 3000 MHz
RF or Microwave Device Type: WIDE BAND LOW POWER
Gain: 24 dB
Power Supplies (V): 5
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