NXP Semiconductors - BGY887B,112

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BGY887B,112 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number BGY887B,112
Description WIDE BAND HIGH POWER; Package Body Material: PLASTIC/EPOXY; Technology: HYBRID; Minimum Operating Frequency: 40 MHz; Characteristic Impedance: 75 ohm; Maximum Operating Frequency: 860 MHz;
Datasheet BGY887B,112 Datasheet
In Stock2,169
NAME DESCRIPTION
Other Names: BGY887B-ND
934027320112
NXPNXPBGY887B,112
2156-BGY887B112-NX
568-5631
BGY887B,112-ND
BGY887B112-CHP
954-BGY887B112
BGY887B
Package Body Material: PLASTIC/EPOXY
Construction: MODULE
Minimum Operating Frequency: 40 MHz
Sub-Category: RF/Microwave Amplifiers
Maximum Supply Current: 340 mA
Minimum Operating Temperature: -20 Cel
Package Equivalence Code: SOT-115J
Technology: HYBRID
Characteristic Impedance: 75 ohm
Additional Features: LOW NOISE
Maximum Operating Temperature: 100 Cel
Maximum Operating Frequency: 860 MHz
RF or Microwave Device Type: WIDE BAND HIGH POWER
Gain: 29 dB
Power Supplies (V): 24
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