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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | BLD6G22LS-50 |
| Description | N-CHANNEL; Configuration: COMPLEX; Surface Mount: YES; Maximum Operating Temperature: 200 Cel; Package Shape: RECTANGULAR; No. of Terminals: 4; |
| Datasheet | BLD6G22LS-50 Datasheet |
| In Stock | 1,225 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | CERAMIC, METAL-SEALED COFIRED |
| Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
| Configuration: | COMPLEX |
| Transistor Element Material: | SILICON |
| Field Effect Transistor Technology: | METAL-OXIDE SEMICONDUCTOR |
| Transistor Application: | AMPLIFIER |
| Maximum Drain Current (ID): | 10.2 A |
| Polarity or Channel Type: | N-CHANNEL |
| Surface Mount: | YES |
| No. of Terminals: | 4 |
| Minimum DS Breakdown Voltage: | 65 V |
| Qualification: | Not Qualified |
| Terminal Position: | DUAL |
| Package Style (Meter): | FLATPACK |
| JESD-30 Code: | R-CDFP-F4 |
| No. of Elements: | 2 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | FLAT |
| Operating Mode: | ENHANCEMENT MODE |
| Highest Frequency Band: | S BAND |
| Maximum Operating Temperature: | 200 Cel |
| Case Connection: | SOURCE |
| Peak Reflow Temperature (C): | NOT SPECIFIED |
| Moisture Sensitivity Level (MSL): | NOT APPLICABLE |
