COMPLEX RF Power Field Effect Transistors (FET) 18

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Part RoHS Manufacturer Polarity or Channel Type Configuration Surface Mount Maximum Power Dissipation (Abs) Package Body Material Transistor Application Minimum DS Breakdown Voltage Minimum Power Gain (Gp) Terminal Form Package Shape Operating Mode No. of Elements Highest Frequency Band Maximum Pulsed Drain Current (IDM) Maximum Drain Current (Abs) (ID) No. of Terminals Package Style (Meter) Sub-Category Field Effect Transistor Technology Maximum Power Dissipation Ambient Maximum Operating Temperature Transistor Element Material Minimum Operating Temperature Terminal Finish Maximum Drain-Source On Resistance Maximum Drain Current (ID) Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Case Connection Qualification Additional Features JEDEC-95 Code JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Maximum Feedback Capacitance (Crss) Reference Standard

A3T18H455W23SR6

NXP Semiconductors

N-CHANNEL

COMPLEX

YES

CERAMIC, METAL-SEALED COFIRED

AMPLIFIER

65 V

15 dB

FLAT

RECTANGULAR

ENHANCEMENT MODE

2

L BAND

6

FLATPACK

METAL-OXIDE SEMICONDUCTOR

225 Cel

SILICON

-40 Cel

QUAD

R-CQFP-F6

40

260

A3T21H450W23SR6

NXP Semiconductors

N-CHANNEL

COMPLEX

YES

CERAMIC, METAL-SEALED COFIRED

AMPLIFIER

65 V

14.2 dB

FLAT

RECTANGULAR

ENHANCEMENT MODE

2

S BAND

6

FLATPACK

METAL-OXIDE SEMICONDUCTOR

225 Cel

SILICON

-40 Cel

QUAD

R-CQFP-F6

40

260

A2T20H160W04NR3

NXP Semiconductors

N-CHANNEL

COMPLEX

YES

PLASTIC/EPOXY

AMPLIFIER

65 V

16 dB

FLAT

RECTANGULAR

ENHANCEMENT MODE

2

S BAND

4

FLATPACK

METAL-OXIDE SEMICONDUCTOR

225 Cel

SILICON

-40 Cel

TIN

DUAL

R-PDFP-F4

3

SOURCE

e3

40

260

BLD6G21LS-50

NXP Semiconductors

N-CHANNEL

COMPLEX

YES

CERAMIC, METAL-SEALED COFIRED

AMPLIFIER

65 V

FLAT

RECTANGULAR

ENHANCEMENT MODE

2

S BAND

4

FLATPACK

METAL-OXIDE SEMICONDUCTOR

200 Cel

SILICON

10.2 A

DUAL

R-CDFP-F4

NOT APPLICABLE

SOURCE

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

A3T18H408W24SR3

NXP Semiconductors

N-CHANNEL

COMPLEX

YES

CERAMIC, METAL-SEALED COFIRED

AMPLIFIER

65 V

14.3 dB

FLAT

RECTANGULAR

ENHANCEMENT MODE

2

L BAND

6

FLATPACK

METAL-OXIDE SEMICONDUCTOR

225 Cel

SILICON

-40 Cel

QUAD

R-CQFP-F6

40

260

934063511112

NXP Semiconductors

N-CHANNEL

COMPLEX

YES

CERAMIC, METAL-SEALED COFIRED

AMPLIFIER

65 V

FLAT

RECTANGULAR

ENHANCEMENT MODE

2

S BAND

4

FLANGE MOUNT

METAL-OXIDE SEMICONDUCTOR

SILICON

10.2 A

DUAL

R-CDFM-F4

SOURCE

934063508112

NXP Semiconductors

N-CHANNEL

COMPLEX

YES

CERAMIC, METAL-SEALED COFIRED

AMPLIFIER

65 V

FLAT

RECTANGULAR

ENHANCEMENT MODE

2

S BAND

4

FLANGE MOUNT

METAL-OXIDE SEMICONDUCTOR

SILICON

10.2 A

DUAL

R-CDFM-F4

SOURCE

BLD6G21L-50

NXP Semiconductors

N-CHANNEL

COMPLEX

YES

CERAMIC, METAL-SEALED COFIRED

AMPLIFIER

65 V

FLAT

RECTANGULAR

ENHANCEMENT MODE

2

S BAND

4

FLANGE MOUNT

METAL-OXIDE SEMICONDUCTOR

200 Cel

SILICON

10.2 A

DUAL

R-CDFM-F4

NOT APPLICABLE

SOURCE

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

934063512112

NXP Semiconductors

N-CHANNEL

COMPLEX

YES

CERAMIC, METAL-SEALED COFIRED

AMPLIFIER

65 V

FLAT

RECTANGULAR

ENHANCEMENT MODE

2

S BAND

4

FLATPACK

METAL-OXIDE SEMICONDUCTOR

SILICON

10.2 A

DUAL

R-CDFP-F4

SOURCE

BLD6G22LS-50

NXP Semiconductors

N-CHANNEL

COMPLEX

YES

CERAMIC, METAL-SEALED COFIRED

AMPLIFIER

65 V

FLAT

RECTANGULAR

ENHANCEMENT MODE

2

S BAND

4

FLATPACK

METAL-OXIDE SEMICONDUCTOR

200 Cel

SILICON

10.2 A

DUAL

R-CDFP-F4

NOT APPLICABLE

SOURCE

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

BLF7G21LS-160

NXP Semiconductors

N-CHANNEL

COMPLEX

YES

CERAMIC, METAL-SEALED COFIRED

AMPLIFIER

65 V

17 dB

FLAT

RECTANGULAR

ENHANCEMENT MODE

2

S BAND

4

FLATPACK

METAL-OXIDE SEMICONDUCTOR

200 Cel

SILICON

DUAL

R-CDFP-F4

SOURCE

NOT SPECIFIED

NOT SPECIFIED

IEC-60134

A3T21H400W23SR6

NXP Semiconductors

N-CHANNEL

COMPLEX

YES

CERAMIC, METAL-SEALED COFIRED

AMPLIFIER

65 V

14.5 dB

FLAT

RECTANGULAR

ENHANCEMENT MODE

2

S BAND

6

FLATPACK

METAL-OXIDE SEMICONDUCTOR

225 Cel

SILICON

-40 Cel

QUAD

R-CQFP-F6

40

260

A3T18H360W23SR6

NXP Semiconductors

N-CHANNEL

COMPLEX

YES

CERAMIC, METAL-SEALED COFIRED

AMPLIFIER

65 V

16 dB

FLAT

RECTANGULAR

ENHANCEMENT MODE

2

L BAND

6

FLATPACK

METAL-OXIDE SEMICONDUCTOR

225 Cel

SILICON

-40 Cel

QUAD

R-CQFP-F6

40

260

934063509112

NXP Semiconductors

N-CHANNEL

COMPLEX

YES

CERAMIC, METAL-SEALED COFIRED

AMPLIFIER

65 V

FLAT

RECTANGULAR

ENHANCEMENT MODE

2

S BAND

4

FLATPACK

METAL-OXIDE SEMICONDUCTOR

SILICON

10.2 A

DUAL

R-CDFP-F4

SOURCE

A3T18H400W23SR6

NXP Semiconductors

N-CHANNEL

COMPLEX

YES

CERAMIC, METAL-SEALED COFIRED

AMPLIFIER

65 V

16 dB

FLAT

RECTANGULAR

ENHANCEMENT MODE

2

L BAND

6

FLATPACK

METAL-OXIDE SEMICONDUCTOR

225 Cel

SILICON

-40 Cel

QUAD

R-CQFP-F6

40

260

BLD6G22L-50

NXP Semiconductors

N-CHANNEL

COMPLEX

YES

CERAMIC, METAL-SEALED COFIRED

AMPLIFIER

65 V

FLAT

RECTANGULAR

ENHANCEMENT MODE

2

S BAND

4

FLANGE MOUNT

METAL-OXIDE SEMICONDUCTOR

200 Cel

SILICON

10.2 A

DUAL

R-CDFM-F4

NOT APPLICABLE

SOURCE

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

PTFB213004FV1

Infineon Technologies

N-CHANNEL

COMPLEX

YES

CERAMIC, METAL-SEALED COFIRED

AMPLIFIER

65 V

FLAT

RECTANGULAR

ENHANCEMENT MODE

2

S BAND

4

FLANGE MOUNT

METAL-OXIDE SEMICONDUCTOR

SILICON

DUAL

R-CDFM-F4

SOURCE

Not Qualified

DE375-501N16A

Littelfuse

N-CHANNEL

COMPLEX

YES

CERAMIC, METAL-SEALED COFIRED

SWITCHING

500 V

FLAT

RECTANGULAR

ENHANCEMENT MODE

2

VERY HIGH FREQUENCY BAND

4

FLATPACK

METAL-OXIDE SEMICONDUCTOR

150 Cel

SILICON

16 A

DUAL

R-CDFP-F4

Not Qualified

AVALANCHE RATED

NOT SPECIFIED

NOT SPECIFIED

RF Power Field Effect Transistors (FET)

RF Power Field Effect Transistors (FET) are electronic devices used in high-frequency RF (radio frequency) applications to amplify and control high-power signals. They are commonly used in applications such as broadcasting, radar, and satellite communications.

RF Power FETs are designed to handle high-power levels and operate at high frequencies, typically in the range of a few MHz to several GHz. They have a low on-resistance and high gain, making them suitable for high-power amplification.

The RF Power FET consists of a gate, source, and drain electrode, and works by controlling the flow of majority charge carriers (electrons or holes) between the source and drain regions through the gate electrode. When a voltage is applied to the gate electrode, it creates an electric field that modifies the conductivity of the channel, allowing current to flow between the source and drain.

RF Power FETs are available in various types and configurations, including N-channel and P-channel FETs, and can handle power levels ranging from a few watts to several kilowatts. They are subject to various standards and regulations, such as JEDEC (Joint Electron Device Engineering Council) and RoHS (Restriction of Hazardous Substances), to ensure their safety and performance.