NXP Semiconductors - BU2725DF

BU2725DF by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number BU2725DF
Description NPN; Configuration: SINGLE WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Power Dissipation (Abs): 45 W; Maximum Collector Current (IC): 12 A; Transistor Application: SWITCHING;
Datasheet BU2725DF Datasheet
In Stock3,793
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Collector Current (IC): 12 A
Configuration: SINGLE WITH BUILT-IN DIODE AND RESISTOR
Transistor Element Material: SILICON
Transistor Application: SWITCHING
Sub-Category: Other Transistors
Polarity or Channel Type: NPN
Surface Mount: NO
Minimum DC Current Gain (hFE): 3.8
No. of Terminals: 3
Qualification: Not Qualified
Maximum Power Dissipation (Abs): 45 W
Terminal Position: SINGLE
Package Style (Meter): FLANGE MOUNT
Maximum Turn Off Time (toff): 2300 ns
JESD-30 Code: R-PSFM-T3
No. of Elements: 1
Package Shape: RECTANGULAR
Terminal Form: THROUGH-HOLE
Maximum Operating Temperature: 150 Cel
Case Connection: ISOLATED
Maximum VCEsat: 1 V
Maximum Power Dissipation Ambient: 45 W
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