NXP Semiconductors - HT2DC20S20/F/RSP

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HT2DC20S20/F/RSP by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number HT2DC20S20/F/RSP
Description TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel; Package Body Material: PLASTIC/EPOXY;
Datasheet HT2DC20S20/F/RSP Datasheet
In Stock3,269
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Telecom IC Type: TELECOM CIRCUIT
Sub-Category: Other Telecom ICs
Surface Mount: YES
Terminal Finish: SILVER
JESD-609 Code: e4
Minimum Operating Temperature: -40 Cel
No. of Functions: 1
Qualification: Not Qualified
Package Equivalence Code: MODULE(UNSPEC)
Terminal Position: UNSPECIFIED
Package Style (Meter): SPECIAL SHAPE
Technology: HYBRID
JESD-30 Code: R-PXSS-N
Package Shape: RECTANGULAR
Terminal Form: NO LEAD
Maximum Operating Temperature: 85 Cel
Temperature Grade: INDUSTRIAL
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