NXP Semiconductors - HT2MOA2S20/E/3,118

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HT2MOA2S20/E/3,118 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number HT2MOA2S20/E/3,118
Description TELECOM CIRCUIT; Package Style (Meter): MICROELECTRONIC ASSEMBLY; Technology: HYBRID; Qualification: Not Qualified; Package Equivalence Code: MODULE(UNSPEC); Package Body Material: PLASTIC/EPOXY;
Datasheet HT2MOA2S20/E/3,118 Datasheet
In Stock1,328
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Qualification: Not Qualified
Package Equivalence Code: MODULE(UNSPEC)
Telecom IC Type: TELECOM CIRCUIT
Package Style (Meter): MICROELECTRONIC ASSEMBLY
Technology: HYBRID
Sub-Category: Other Telecom ICs
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