NXP Semiconductors - LH7A404N0E000B2

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LH7A404N0E000B2 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number LH7A404N0E000B2
Description Other uPs/uCs/Peripheral ICs; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 324; Package Code: FBGA; Package Shape: SQUARE;
Datasheet LH7A404N0E000B2 Datasheet
In Stock569
NAME DESCRIPTION
Package Body Material: CERAMIC
Sub-Category: Other uPs/uCs/Peripheral ICs
Surface Mount: YES
Minimum Operating Temperature: 0 Cel
No. of Terminals: 324
Qualification: Not Qualified
Package Equivalence Code: BGA324,20X20,32
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, FINE PITCH
JESD-30 Code: S-XBGA-B324
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 70 Cel
Package Code: FBGA
Terminal Pitch: .8 mm
Temperature Grade: COMMERCIAL
Power Supplies (V): 1.8,3.3
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