MCIMX6Y2DVM09AB by NXP Semiconductors | Peripheral ICs

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Manufacturer	NXP Semiconductors
Manufacturer's Part Number	MCIMX6Y2DVM09AB
Description	SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;
Datasheet	MCIMX6Y2DVM09AB Datasheet
In Stock	414

NAME	DESCRIPTION
Minimum Supply Voltage:	1.25 V
Package Body Material:	PLASTIC/EPOXY
Nominal Supply Voltage:	1.275 V
Maximum Time At Peak Reflow Temperature (s):	40
Maximum Seated Height:	1.32 mm
Surface Mount:	YES
Terminal Finish:	TIN SILVER COPPER
No. of Terminals:	289
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, LOW PROFILE, FINE PITCH
Technology:	CMOS
JESD-30 Code:	S-PBGA-B289
Package Shape:	SQUARE
Terminal Form:	BALL
Maximum Operating Temperature:	95 Cel
Package Code:	LFBGA
Width:	14 mm
Moisture Sensitivity Level (MSL):	3
Peripheral IC Type:	SYSTEM ON CHIP
Maximum Supply Voltage:	1.3 V
JESD-609 Code:	e1
Minimum Operating Temperature:	0 Cel
Package Equivalence Code:	BGA289,17X17,32
Length:	14 mm
Peak Reflow Temperature (C):	260
Terminal Pitch:	.8 mm
Temperature Grade:	OTHER

Pricing (USD)

Qty.	Unit Price	Ext. Price
414	-	-

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